FEATURED NEWS AND INFORMATION:
FEATURED ARTICLES AND COLUMNS:

A Twist on Printed Electronics: Printing on 3D Shapes

June 23, 2017 | Barry Matties, I-Connect007

Barry Matties speaks with Optomec’s Pascal Pierra about their LENS printer systems and Aerosol Jet technology, which allows manufacturers to print applications like sensors and antennas on 3D objects. The process is significantly faster and greener than competing technologies.



FEATURED COLUMNS:

Through-hole etchback is a requirement that is sometimes specified on medical, military and aerospace procurement documents for multilayer flexible circuits and combination multilayer flex/rigid board circuits. It specifically relates...

Flex Talk: Mina—Trouble-Free Soldering to Aluminum

June 22, 2017 | Tara Dunn, Omni PCB

Thinking about the RFID market and the significant growth projected in this market, I decided to do a little research on RFID tag manufacturing. During this research, I learned of a relatively new offering, Mina, an advanced surface...

DKN Research Newsletter: JPCA Show a Positive Sign for Industry

June 13, 2017 | Dominique Numakura, DKN Research

I recently attended the JPCA Show, the largest trade show event for the printed circuit industry. The size of the show was almost the same as last year, but there were significant changes to product lines from material suppliers. It...

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