IPC to Unveil New Member Magazine, ‘IPC Community’ at IPC APEX EXPO 2023

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IPC, in partnership with IPC Publishing Group (I-Connect007) will unveil an exciting new publication, "IPC Community," at IPC APEX EXPO 2023, as a continuation of its commitment to better serve the electronics industry and provide additional value for IPC members.

The quarterly magazine will be offered in a digital format and will serve as a valuable new resource designed to keep the IPC global community up to date on the latest IPC news, including industry updates, trends and technology.

The digital edition will be made available the week of January 22, 2023, at IPC APEX EXPO. The magazine will receive bonus circulation with printed copies exclusively available at the show.

Inside “IPC Community,” readers will find feature stories that celebrate member success along with articles on advocacy efforts, committee and standards updates, education and workforce training developments, factory of the future solutions, advanced packaging updates emerging engineer and member profiles, and more.

“Our members and the broader global electronics manufacturing community look to IPC as a steadfast resource to keep them informed and educated on the latest industry developments,” said Brian Knier, IPC vice president, marketing, member success and sales. “We’re excited about the possibilities of “IPC

Community” taking our ability to disseminate timely and important information to the next level; all while making sure IPC members’ voices are reflected within the magazine.”

Added Michelle Te, “IPC Community” magazine managing editor, “Through its family of publications offering thought-provoking, original content, I-Connect007 prides itself ’in being ‘good for the industry.’ With the launch of ‘IPC Community,’ IPC and I-Connect007 are now even better for the industry. There is much to recognize and celebrate.”

To subscribe to “IPC Community,” visit www.ipc.org/subscribe-ipc-community. For inquiries regarding advertising opportunities within the magazine, contact Barb Hockaday, ad sales manager, at barb@iconnect007.com. To suggest a member success story, contact Michelle Te at michelle@iconnect007.com.

03/17/2023 | Patty Goldman, I-Connect007

Sarah Czaplewski-Campbell, a materials/product development engineer at IBM, shares her experiences as a young professional who has benefited from the guidance of seasoned mentors alongside her own unflagging drive to expand her industry knowledge. She offers poignant advice for prospective professionals, urging them to assertively seek out advice and experiences that will help them progress in their careers.

03/16/2023 | Pete Starkey, I-Connect007

Widely believed to be the traditional Centre of England, Meriden was a popular venue for a gathering of the UK printed circuit community this month. They braved the forecast of heavy snow for the Institute of Circuit Technology’s annual general meeting to learn about current developments and challenges in a thought-provoking technical seminar and to network with industry peers and contemporaries. Thankfully, the forecasted heavy snowfall did not reach Meriden until after the event; we only had a few flurries, although the weather caused considerable disruption elsewhere in the country.

03/15/2023 | Patty Goldman, I-Connect007

As a young industry professional, Paige Fiet, a process engineer at TTM Logan, sees mentorship as a formative component of her success in IPC. Alongside the support and guidance of her mentors, Paige has distinguished herself as an emerging leader who brings a fresh perspective to the many topics currently of interest to the industry.