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iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging

05/13/2024 | iNEMI
Advanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling.

Schweizer Receives Future Prize from Ewald Marquardt Private Foundation for p² Pack Embedding Technology

05/10/2024 | Schweizer Electronic AG
As the number of electric vehicles increases, so do the demands on electrical power management in vehicles. To make power generation and engine operation more efficient, Schweizer Electronic AG's p² Pack technology offers a long-term and sustainable solution to better convert and even recover the energy generated.

MKS’ Atotech to Participate in ECTC

05/10/2024 | MKS’ Atotech
At this year’s 74th IEEE Electronic Components and Technology Conference (ECTC), MKS’ Atotech will present and demonstrate its latest product and service innovations.

Polish Industrial Partners Complete Five Major Offsets Projects

05/09/2024 | Lockheed Martin
The Ministry of Defence officially approved five completed Offset projects in the first phase of the WISLA programme. Lockheed Martin partnered with local industrial partners to increase technical capabilities and provide manufacturing know-how of components related to Patriot Advanced Capability – 3 (PAC-3) Missile Segment Enhancement (MSE) and in support of Poland’s air and missile defence.

Space Tech Startup Xona Raises $19M Series A for its Cutting-Edge Satellite Navigation Service

05/08/2024 | PRNewswire
Xona  - a company developing a network of small satellites to provide high-precision navigation services - announced an oversubscribed $19 million Series A funding round led by Future Ventures and Seraphim Space. New investors NGP Capital, Industrious Ventures, Murata Electronics, Space Capital, and Aloniq also joined the round.
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