AT&S Releases Annual General Meeting Results
July 9, 2021 | AT&SEstimated reading time: Less than a minute
The 27th Annual General Meeting of AT & S Austria Technologie und Systemtechnik Aktiengesellschaft (AT&S), which was held virtually, adopted a dividend of € 0.39 per share for the financial year 2020/21.
The ex-dividend day is 27 July 2021, the record day is 28 July 2021 and the dividend payment day is 29 July 2021. Deloitte Audit Wirtschaftsprüfungs GmbH was appointed the statutory auditor of the financial statements and consolidated financial statements for the financial year 2021/22.
In addition, to repurchase shares in the Company and any related cancellation of shares, today’s Annual General Meeting authorized the Supervisory Board to make amendments to the Articles of Association resulting from the cancellation of shares and to revoke the related resolution of the Annual General Meeting of July 4, 2019. All other agenda items presented for resolution were also adopted by the shareholders represented at the Annual General Meeting.
Suggested Items
IPC's Vision for Empowering PCB Design Engineers
04/30/2024 | Robert Erickson, IPCAs architects of innovation, printed circuit board designers are tasked with translating increasingly complex concepts into tangible designs that power our modern world. IPC provides the necessary community, standards framework, and education to prepare these pioneers as they explore the boundaries of what’s possible, equipping engineers with the knowledge, skills, and resources required to thrive in an increasingly dynamic field.
USPAE to Springboard U.S. Technology Forward
04/30/2024 | Marcy LaRont, PCB007 MagazineThe U.S. Partnership for Assured Electronics (USPAE) was launched as a nonprofit subsidiary of IPC in 2020, specifically to manage the DoD relationship and access to funding, and to develop a cooperative facility to develop UHDI capabilities in the U.S., not only for the defense sector, but for the whole of the U.S. electronics industry. It is a tall order, but industry veteran Joe O'Neil believes it will happen. Having been tasked with making the UHDI Capable Cooperative Production Facility (UCCPF) a reality, he provides an update on this important project for U.S. electronics manufacturing.
North American PCB Industry Sales Down 23.8% in March
04/29/2024 | IPCIPC announced the March 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.13.
EIPC Issues Letter of Urgency
04/29/2024 | Alun Morgan, EIPCAlun Morgan, president of EIPC, issued a letter last week in an effort to raise awareness of the state of PCB manufacturing in Europe. He writes, "The European PCB manufacturing industry and its supply base has been steadily shrinking since the dot com crash at the start of the millennium. European demand for PCBs and assemblies has, however, continued to grow, thus creating an ever-widening gap between European domestic capacity and consumption. The risks posed by this imbalanced supply and demand pattern came into sharp focus during the Covid-19 pandemic which caused chaos in extended supply chains across the world and resulted in widespread shortages."
New Appointment Strengthens Ventec’s Value-Added Equipment Division
04/29/2024 | VentecVentec announces the appointment of Leigh Allinson as Commercial Director for its value-added PCB Equipment division 'Ventec Giga Solutions'.