TTM Technologies Exhibiting at 2018 HKPCA & IPC Show
December 6, 2018 | Globe NewswireEstimated reading time: Less than a minute
TTM Technologies, Inc. is at the annual International Printed Circuit & APEX South China Fair (2018 HKPCA & IPC Show) at booth 1L01. The Fair is themed "Inspire the Industry. Explore the Infinity,” and runs one more day (until December 7) at the Shenzhen Convention and Exhibition Center in Shenzhen, China. As part of the exhibition, TTM Technologies has also been conducting technical seminars on topics including “PCB Technology for Advanced Driver-Assistance Systems (ADAS),” “mSAP Technology,” and “Liquid Crystal Polymer (LCP) applications for Flex.” TTM Technologies' sales and technical experts are available for product and technical on-site discussions.
“The HKPCA & IPC Show is the major PCB show of the year in Asia, and we look forward to our participation each year as it provides a great opportunity to connect with our regional customers as well as our suppliers, and to showcase our industry leading technologies,” said Kent Hardwick, TTM Technologies’ senior vice president of global sales. “As a PCB and RF components technology leader, TTM Technologies strives to engage early and collaboratively with our customers to inspire innovative solutions for the ever-advancing electronics industry.”
Be sure to stop by the TTM Technologies booth today!
Suggested Items
Samsung Electronics Begins Industry’s First Mass Production of 9th-Gen V-NAND
04/29/2024 | Samsung ElectronicsSamsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass production for its one-terabit (Tb) triple-level cell (TLC) 9th-generation vertical NAND (V-NAND), solidifying its leadership in the NAND flash market.
Arlon Electronic Materials Awarded Requalification to IPC-4101 QPL for All Polyimide Specification Sheets
04/29/2024 | IPCIPC's Validation Services Program has awarded Arlon Electronic Materials Division, an electronics material manufacturing company headquartered in Rancho Cucamonga, Calif., an IPC-4101 Qualified Products Listing (QPL) requalification for the third time.
Lockheed Martin Australia, The Department Of Defence Sign Strategic Partnership Head Contract
04/26/2024 | Lockheed MartinLockheed Martin Australia signed a landmark AUD$500 million contract with the Department of Defence to build Australia’s future Joint Air Battle Management System under project - AIR6500 Phase 1 (AIR6500-1).
SMC Korea 2024 to Highlight Semiconductor Materials Trends and Innovations on Industry’s Path to $1 Trillion
04/24/2024 | SEMIWith Korea a major consumer of semiconductor materials and advanced materials a key driver of innovation on the industry’s path to $1 trillion, industry leaders and experts will gather at SMC (Strategic Materials Conference) Korea 2024 on May 29 at the Suwon Convention Center in Gyeonggi-do, South Korea to provide insights into the latest materials developments and trends. Registration is open.
Elevating PCB Design Engineering With IPC Programs
04/24/2024 | Cory Blaylock, IPCIn a monumental stride for the electronics manufacturing industry, IPC has successfully championed the recognition of the PCB Design Engineer as an official occupation by the U.S. Department of Labor (DOL). This pivotal achievement not only underscores the critical role of PCB design engineers within the technology landscape, but also marks the beginning of a transformative journey toward nurturing a robust, skilled workforce ready to propel our industry into the future.