RF/Microwave eBook: Beneficial Tool for Engineers
October 22, 2018 | I-Connect007Estimated reading time: 1 minute
Released earlier this year, hundreds of engineers and other readers interested in PCB design have downloaded The Printed Circuit Designer’s Guide to… Fundamentals of RF/Microwave PCBs micro eBook.
This book is part of I-Connect007’s ongoing series, The Printed Circuit Designer’s Guide to…, which is specifically dedicated to educating PCB designers and serves as a valuable resource for readers seeking the most relevant information available. Written by American Standard Circuits’ John Bushie and Anaya Vardya, Fundamentals of RF/Microwave PCBs is a strong follow-up to their first design title, Flex & Rigid-Flex Fundamentals.
This book provides information needed to grasp the unique challenges of RF PCBs. The authors answer two main questions: what is the correct material to use for a particular project, and what can be done at the design stage to make a product more manufacturable? Readers, especially RF PCB designers, will gain a better understanding of issues related to the design and manufacture of RF/microwave devices from a PCB fabricator perspective.
“[This book] can be read in one sitting and speaks to engineering, design, layout, materials, and procurement,” commented Darren Smith, Athenatech U.S.A. "It’s a critical read for designers new to RF layout or combining multiple impedance environments."
Judy Warner, director of community engagement at Altium, stated, "This concise, yet very thorough book is destined to become every RF and microwave engineer's PCB fabrication bible. From material selection to skin-effect and the complexity of heat sink technology, ASC has shared every key aspect to fabricate these incredibly challenging boards successfully. Read it and watch your yields increase and your re-spins decrease!"
Download your free copy today! You can also view and download other titles in our full library.
We hope you enjoy The Printed Circuit Designer’s Guide to… Fundamentals of RF/Microwave PCBs.
For more information, contact:
Barb Hockaday
I-007eBooks
barb@iconnect007.com
+1-916-365-1727
Suggested Items
Real Time with… IPC APEX EXPO 2024: Ventec Discusses New Pro-bond Family of Advanced Products
05/01/2024 | Real Time with...IPC APEX EXPOChris Hanson, Ventec's Global Head of IMS Technology, outlines the launch of four pro-bond formulas that deliver an outstanding combination of low dissipation factor (Df) with a dielectric constant (Dk) range to maximize the design window for critical PCB parameters. As Chris points out, Pro-bond is designed for low-loss, high-speed applications, while thermal-bond dissipates heat from a component through the board to a heat sink.
IPC's Vision for Empowering PCB Design Engineers
04/30/2024 | Robert Erickson, IPCAs architects of innovation, printed circuit board designers are tasked with translating increasingly complex concepts into tangible designs that power our modern world. IPC provides the necessary community, standards framework, and education to prepare these pioneers as they explore the boundaries of what’s possible, equipping engineers with the knowledge, skills, and resources required to thrive in an increasingly dynamic field.
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Ansys, TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems
04/25/2024 | PRNewswireAnsys announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration system and Co-Packaged Optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.