American Standard to Exhibit at the Ohio Valley Expo and Tech Forum
June 27, 2018 | American Standard CircuitsEstimated reading time: 1 minute
Printed circuit board fabricator, American Standard Circuits will be exhibiting at this year’s Ohio Valley Expo and Tech Forum to be held at the Embassy Suites, Cleveland, Rockside on July 12 from 9:00 AM to 12:30 PM.
American Standard CEO Anaya Vardya stated, “This show is an excellent opportunity for us to meet with local customers, both current and potential, face to face. This year we will talking to both current customers and potential customers about our increased capabilities in flex/rigid flex and RF/metal backed technology. We look forward to this year’s show, as we do every year.”
About American Standard Circuits
American Standard Circuits (ASC) prides itself on being a total solutions provider, manufacturing quality rigid, metal-backed, RF/microwave, flex, and rigid-flex PCBs for the medical, automotive, industrial, defense, and aerospace markets in volumes from test and prototypes to large production orders. ASC has the expertise to provide a wide variety of technologies in a time-critical environment. Their qualifications include AS9100 Rev D, ISO 9001:2015, MIL-PRF 31032, MIL-PRF-55110, MIL-PRF-50884 certification and ITAR registration. In addition to manufacturing in the USA, ASC can transition and manage your PCB requirements to lower cost regions via its qualified supply chain of offshore partners. ASC also holds many key patents for metal bonding processes. For more information about American Standard Circuits' services or to ask one of their technology experts a question click here.
Visit I-007eBooks to download your copies of American Standard Circuits’ micro eBooks today:
The Printed Circuit Board Designer’s Guide… to Fundamentals of RF/ Microwave PCBs
The Printed Circuit Designer's Guide to... Flex and Rigid-Flex Fundamentals
Suggested Items
iNEMI Names Grace O'Malley CTO
05/02/2024 | iNEMIThe Board of Directors of the International Electronics Manufacturing Initiative (iNEMI) has named Grace O'Malley Chief Technical Officer (CTO).
Intel Takes Next Step Toward Building Scalable Silicon-Based Quantum Processors
05/02/2024 | BUSINESS WIRENature published an Intel research paper, “Probing single electrons across 300-mm spin qubit wafers,” demonstrating state-of-the-art uniformity, fidelity and measurement statistics of spin qubits.
ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series
05/01/2024 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges.
NextFlex Convenes the Hybrid Electronics Community at Binghamton University
05/01/2024 | NextFlexBinghamton University hosted the NextFlex hybrid electronics community on April 18 for a day of expert presentations, breakout sessions on technology and manufacturing topics, and networking.
HQ NextPCB of HQ Electronics Debut on the International Stage for Electronics Manufacture at IPC APEX 2024
05/01/2024 | PRNewswireHQ NextPCB of HQ Electronics, a leading Chinese-based multilayer PCB manufacturer and assembly house showcased its industrial prowess on the international stage for the first time at the IPC APEX Expo 2024.