FlexFactor Program Informs, Inspires, Attracts, and Recruits Talent

May 24, 2019 | Nolan Johnson and Barry Matties, I-Connect007

Barry Matties and Nolan Johnson speak with Brynt Parmeter, Emily McGrath, Clarence Chi, and Mikayla Ridi about the NextFlex program FlexFactor. This initiative aims to help high school and college students see potential futures in the advanced manufacturing sector and combat common misperceptions young people might have about modern-day manufacturing.

Growing Opportunities with 3D Printed Electronics

May 22, 2019 | Barry Matties, I-Connect007

Dr. Kurt Christenson, senior scientist at Optomec, discusses the company’s Aerosol Jet technology, which eliminates the need for wire bonding by printing interconnects on 3D surfaces. Christenson also explores the current state of the technology and highlights the market segments and applications with the most to benefit from being able 3D print electronic components, such as resistors, capacitors, antennas, and transistors.

DuPont on New Beginnings and Empowering the Industry

May 21, 2019 | I-Connect007 Editorial Team

Andy Kannurpatti gives the I-Connect007 team an overview of the latest news from DuPont Electronics and Imaging, including investments toward the new production assets in Ohio, Silicon Valley Technology Center, and other facilities. He also details how the company is engaging OEMs and PCB fabricators and design teams, as well as some exciting business updates coming this spring and summer.

Flex Time: Alternative Constructions in Rigid-flex Designs

May 17, 2019 | Bob Burns, Printed Circuits, Inc.

In his last column, Bob Burns discussed how manufacturers of rigid-flex boards use techniques similar to those used by manufacturers of hard boards and flexible circuits, and how techniques vary. That column’s discussion was for a standard, straightforward rigid-flex design. This column will talk more about non-standard designs, which can present process difficulties and require extra care for effective yields.

Learning to Be More Flexible: Case Studies on Improving FPC Design

May 14, 2019 | Todd MacFadden, Bose Corporation

As miniaturization requirements force manufacturers to pack more functionality into ever-smaller packages, it becomes more difficult to conform to IPC construction recommendations. Achieving robust FPCs requires frequent, iterative interaction internally among the mechanical, electrical, and PCB design teams, as well as with the fabricators and assemblers. The sooner in the design cycle you can engage the supplier and assembler, the better.