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The questions I receive most frequently depend upon the individual or group asking the questions. For this column, I will focus on the different questions coming from the manufacturing industry and media.
Columnist Joe Fjelstad not only watched Star Trek with fascination, he grew to become his own inventor, thanks to his father—an aerospace engineer. "The passion for flight, especially rocketry, entered my veins early," he writes.
For flex circuit designs with high layer counts utilizing high density outer layers, the extra area utilized for separate pads and SMT components, severely limits the available space for trace fan out. By designing via-in-pad in flex and rigid flex circuits, it can significantly increase density, utilizing vias as mounting pads. The copper or silver filled flat vias allow for soldering components directly on via holes.
In this month’s column, Kelly Dack conveys the value of honing a skill set and the importance of being able to measure that skill set. Next, I hand it off to our PCEA Chairman Steph Chavez, who offers a positive outlook on PCEA activities over the summer months. Again, I am happy to provide our readers with a growing list of events which are coming up in 2021.
As the electronics industry undergoes dramatic change, it is essential for IPC to obtain advice and counsel from experts throughout the industry that help us navigate these changes. To this end, IPC created the Thought Leaders Program (TLP), a select group of experts who will generate ideas and insights.
