Whether you are new to single- and double-sided flex, moving into rigid-flex construction, thinking of using bookbinder technology, or investigating an additive process, working with new technology can be both exciting and challenging.
An issue that is frequently addressed by many of us in the printed circuit industry, and by others in the world of contract fabrication and assembly, is dealing with the “Terms and Conditions” in a purchase agreement or contract.
At the recent HKPCA and IPC Show 2017 in Shenzhen, China, Chris Ryder, director of product management for HDI at Electro Scientific Industries Inc. (ESI), discusses how laser-based processing is addressing the challenges in HDI development, and MSAP technology and its impact on the PCB industry.
Miraco's current quality manager, William Pfingston, fills Guest Editor Steve Williams in on the company's contract manufacturing capabilities and services, including strengths in design and flex circuits. He also talks about the company's expansion and organizational changes.
The Mars2020 Rover Mission, designed by JPL, is the next NASA Mars Exploration Program mission that is planned to launch in 2020. Some goals of the mission include to check for past signs of life, to help prepare for manned Mars missions, and to collect soil samples and cache them on the surface for potential return to Earth by a future mission.
Autonomous Transportation: Using Disruptive Technologies to Create Social Disruption and Change, by Dan Feinberg
Future Automotive Requirements for PCBs, Dr. Christian Klein
International Automotive Task Force (IATF) 16949 Standard, Explained, by Steve Williams
E-Textiles—the Wild Frontier, by Tara Dunn
Automotive, the Electronics Industry's New Driver, by Patty Goldman