Barry Matties and Nolan Johnson speak with Brynt Parmeter, Emily McGrath, Clarence Chi, and Mikayla Ridi about the NextFlex program FlexFactor. This initiative aims to help high school and college students see potential futures in the advanced manufacturing sector and combat common misperceptions young people might have about modern-day manufacturing.
Dr. Kurt Christenson, senior scientist at Optomec, discusses the company’s Aerosol Jet technology, which eliminates the need for wire bonding by printing interconnects on 3D surfaces. Christenson also explores the current state of the technology and highlights the market segments and applications with the most to benefit from being able 3D print electronic components, such as resistors, capacitors, antennas, and transistors.
Andy Kannurpatti gives the I-Connect007 team an overview of the latest news from DuPont Electronics and Imaging, including investments toward the new production assets in Ohio, Silicon Valley Technology Center, and other facilities. He also details how the company is engaging OEMs and PCB fabricators and design teams, as well as some exciting business updates coming this spring and summer.
In his last column, Bob Burns discussed how manufacturers of rigid-flex boards use techniques similar to those used by manufacturers of hard boards and flexible circuits, and how techniques vary. That column’s discussion was for a standard, straightforward rigid-flex design. This column will talk more about non-standard designs, which can present process difficulties and require extra care for effective yields.
As miniaturization requirements force manufacturers to pack more functionality into ever-smaller packages, it becomes more difficult to conform to IPC construction recommendations. Achieving robust FPCs requires frequent, iterative interaction internally among the mechanical, electrical, and PCB design teams, as well as with the fabricators and assemblers. The sooner in the design cycle you can engage the supplier and assembler, the better.
Welcome to Real Time with… IPC APEX EXPO 2019 Show & Tell by Nolan Johnson
Electronics Industry Comes Together at IPC APEX EXPO 2019 by Dr. John Mitchell
Real Time with… IPC APEX EXPO 2019 Video Showcase and Library
Happy’s Highlights by Happy Holden
Leo Lambert, IPC’s 2019 Hall of Fame Inductee by Patty Goldman
Inspiring the Next Generation of Leaders: IPC STEM Student Outreach Program by Patty Goldman
A STEM Student on FIRST Robotics and Career Opportunities by Barry Matties