FEATURED ARTICLES AND COLUMNS:

American Standard Circuits' Ken Moffat on Flex and Rigid-flex Business

April 22, 2019 | Patty Goldman, I-Connect007

Ken Moffat is the director of business development at American Standard Circuits, where covers a fairly broad territory from his base in Toronto throughout Canada and parts of the U.S. from east to west. In an interview with I-Connect007 at the recent West Penn SMTA Expo, Ken talks about the state of the flex and rigid-flex industry.

EPTE Newsletter: Printable and Flexible Electronics in Taiwan

April 17, 2019 | Dominique Numakura, DKN Research

I was invited as the keynote speaker of Printable and Flexible Electronics, a two-day conference held at the Industrial Technology Research Institute (ITRI) in Taiwan. My presentation included current business trends and future forecast for the global printable and flexible electronics industry. Here's a recap of the event.

A Few Simple Lessons in Designing Reliable 3D Flex

April 11, 2019 | Joe Fjelstad, Verdant Electronics

We all have a tendency to stick close to the familiar and use the tools we know to create solutions to problems confronting us; we're only human. Unfortunately, using only familiar tools limits our ability to come up with optimal or even superior solutions. This article will help you avoid some of the traps conventional wisdom doesn't always give guidance on.

Ventec Focuses on High-mix Manufacturing

April 9, 2019 | Barry Matties, I-Connect007

The I-Connect007 team recently toured Ventec International Group’s Suzhou factory where a modern, flexible manufacturing concept designed for fast delivery is enhancing their established volume manufacturing of specialty, high-reliability epoxy laminates and prepregs. Read on to know more about Ventec's ongoing investment in the facility to offer flexible world-class high-mix manufacturing capabilities for polyimide, thermal management, low-loss, and signal integrity material solutions.

ITEQ’s Tarun Amla Discusses 5G Inflection Points

April 8, 2019 | Andy Shaughnessy, I-Connect007

ITEQ Corporation Executive VP and CTO Tarun Amla discusses effects of 5G on materials and shares general observations on the 5G rollout at DesignCon. He also talks about the challenges for their customers, and how they help them address their issues.



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