FEATURED ARTICLES AND COLUMNS:

ESI’s Chris Ryder: There’s More to Choosing a Laser Than You Think

January 16, 2019 | Barry Matties, I-Connect007

At the recent HKPCA show, I sat down with ESI’s Chris Ryder, director of product management—HDI—to discuss considerations for choosing a new laser system, and how ESI uses its decades of flex and rigid-flex drilling experience to help guide customers in their decision-making process.

Flex Time: Pointers for Your First Rigid-Flex Design

January 9, 2019 | Bob Burns, Printed Circuits, Inc.

If you are new to rigid-flex designs—or have never done a rigid-flex PWB layout—you might wonder how it is similar to and different from hardboard design. In previous columns, I’ve discussed cost drivers in rigid-flex boards and applications where rigid-flex designs will outperform all other packaging methods, which more than justifies the increased cost. In this column, I’ll address critical items you need to know to successfully create a stable and robust rigid-flex design.

Top 10 Most-Viewed FLEX007 Articles in 2018

January 4, 2019 | I-Connect007

Here’s a list of the top 10 most viewed FLEX007 articles in the past year.

The seamless integration of electronics into flexible, curved, and even stretchable surfaces is being requested for several markets, such as automotive (dashboards, lighting, sensors), smart buildings (lighting facades, air quality, solar panels), medical (health patches, X-ray, analysis), and smart clothing (position tracking, sports).

EPTE Newsletter: Sputtering or Chemical Plating?

December 24, 2018 | Dominique Numakura, DKN Research

More than 20 years ago, material manufacturers competed with each other to develop adhesiveless copper-clad laminates for the next generation of flexible circuits. A dozen or so companies were leaders in the pack with their new technologies. These technologies were categorized into two types: a casting and laminating process, and the metallization of polyimide films.



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