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While flexible circuits continue their forward march, over the past decade, there has been increased interest and use of stretchable circuits for a variety of new applications where circuits have the ability to deform and/or elongate elastically and return to their original size. This upstart variation of the venerable flexible circuit has been given the title of "stretchable circuit," and it appears that they are going to be an increasingly important subset of future flexible circuit designs.
This article will present a hybrid manufacturing process to manufacture FHE systems with a two-layer interconnect structure utilizing screen printing of silver conductive ink, filled microvias to connect ink traces at the different layers, and use of the traditional reflow process to attach the semiconductor chips to the printed substrates.
July was a fun, productive month for IPC on the government relations front. Most notably, IPC’s workforce development efforts were recognized at the White House in Washington and on a factory floor in Michigan. On another front, we've launched an online platform that makes it easier for our members to contact their elected officials, and we’re using it to seek more R&D funding for an important industry project.
Copper deposit in the vias with electroless copper or alternatives, such as carbon-based direct plate processes to the vias, depends on process control, equipment design, and chemical parameters. When these are not in control, defects arise. In this installment of the column series, Mike Carano will talk about metallization for HDI blind via processing.
Manufacturing a custom product with 100+ processing steps can be tricky enough, but when you add in a highly complex set of design attributes, pour engineering resources into defining the process, and verify that it is repeatable and reliable, that comes with a certain sense of pride and satisfaction.
