I-Connect007 Editor’s Choice: Five Must-Reads for the Week
December 2, 2022 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes
Normally, the holiday season is a slow(ish) news time, but this year just feels different. My opinion is that the technology industry banked up a whole bunch of innovations and new products during the pandemic disruptions, which are coming to market as quickly as possible. The November/December news is full of technology discussion, as my selections this week clearly demonstrate.
We have a discussion on additively manufactured electronics, as well as a high-level look at fabrication for the UHDI market—both emerging markets. I also noticed that our readers were quite interested in industry reports on U.S. semiconductor industry challenges, and a forward look at the drivers in the flexible PCB fabrication market, so I was sure to include the links again. Finally, I thought I’d share the news item about a new missile guidance system prototype test that caught reader attention and which has garnered quite a bit of attention.
3D Electronic Devices With Additive Manufacturing
Published November 29
In the news on Dec. 1, Nano Dimension issued a press release announcing Q3 2022 results where the company shares that it is on track to increase revenue by 10X over 2020’s results. That news shines a spotlight on this article from Shavi Spinzi discussing the possibilities of additively manufactured electronics.
Global Flexible PCB Market Report 2022: Rising Use in the Aerospace and Aviation Sector Boosts Growth
Published November 25
My recent conversations with flex manufacturers all have a familiar tone: “We’re really busy, capacity is maxed out.” Well, this quote from the Flexible PCB Marketplace Report news release corroborates what I’m hearing: “The [flex] market is expected to surge in the coming years due to the rising use of flexible printed circuit boards in consumer electronics, especially smartphones, laptops, displays, and other electronic devices. According to official industrial sources, around 1.5 billion smartphones were sold in the year 2019.” The article discusses automotive, aviation and aerospace.
Understanding the UHDI Market
Published November 28
This interview with Meredith LaBeau and Todd Brassard from Calumet Electronics included this in the setup to the conversation, “The more we investigate UHDI in the current market, the more advanced packaging becomes a part of the conversation. The two emerging technologies lean on each other for their overall success. UHDI is the method by which state-of-the-art advanced packaging will be fabricated; substrates are creating a market for UHDI capabilities.” In many ways, Calumet is blazing the trail for nimble PCB fabricators to move forward into capabilities that support advanced packaging. Clearly, readers were interested this week in what LaBeau and Brassard had to say.
New Report Identifies Challenges to Continued U.S. Leadership in Semiconductor Design, Innovation
Published November 30
This report from the Semiconductor Industry Association (with Boston Consulting Group) identifies three key areas the U.S. must address in the administration of the CHIPS Act in order to maintain a leadership position: Design and R&D investment needs are on the rise, there is a shortage of domestic design talent, and open access to global markets is under pressure. Take a read and see if you agree.
PAC-3 Intercepts Target In Successful Test of Lockheed Martin Remote Interceptor Guidance
Published November 25
Lockheed Martin announced that their new missile communication device connected with a U.S. Army PAC-3 missile in flight. This prototype system is seen as a step forward in missile guidance systems.
Suggested Items
IDTechEx Examines the Opportunities for Wearables in Digital Health
04/19/2024 | IDTechExIDTechEx’s report, “Digital Health and Artificial Intelligence 2024-2034: Trends, Opportunities, and Outlook”, covers this ongoing trend in the consumer health wearables market and includes analysis of the opportunities and roadmap for biometric monitoring.
ZESTRON Welcomes Whitlock Associates as New Addition to their Existing Rep Team in Florida
04/19/2024 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is thrilled to announce the addition of Whitlock Associates to its esteemed network of sales representatives.
IPC Bestows Posthumous Hall of Fame Award to Industry Icon Michael Ford
04/18/2024 | IPCIPC honored the late Michael Ford, Aegis Software, for his extraordinary contributions to the global electronics manufacturing industry with the IPC Raymond E. Pritchard Hall of Fame Award at IPC APEX EXPO 2024. IPC’s most prestigious honor, the Hall of Fame Award is given to individuals who have provided exceptional service and advancement to IPC and the electronics industry. Ford, an industry leader and valued IPC volunteer, died suddenly in January 2024.
SEMI Applauds U.S. Chips Act Award for Samsung Electronics Facilities to Strengthen Domestic Semiconductor Supply Chain
04/17/2024 | SEMISEMI, the industry association serving the global electronics design and manufacturing supply chain, applauded the United States Department of Commerce’s announcement of a Preliminary Memorandum of Terms for an award under the CHIPS and Science Act to support the expansion of Samsung Electronics’ presence in Texas and the company’s development and production of leading-edge chips.
Northrop Grumman honors Calumet Electronics with Supplier Excellence Award
04/17/2024 | Calumet ElectronicsNorthrop Grumman Corporation has recognized Calumet Electronics during the company’s 2024 Supplier Excellence Awards for “exceptional performance and unwavering commitment to delivering with excellence.” Calumet is one of 70 suppliers recognized from across the globe. In its award category of “Supplier Strategic Excellence,” Calumet was honored alongside global corporations such as Amazon Web Services, Dell Technologies, and Eaton Corporation.