Reading time ( words)
Zhen Ding Technology Holding Ltd, a Taiwan-based company primarily engaged in the design, development, and manufacturing of printed circuit board (PCBs) including rigid PCBs, flex PCBs, HDIs, substrate-like PCBs (SLP), and rigid-flex PCBs, has posted sales of NT$10.34 billion ($351.6 million at $1:NT$29.41) for April 2022, up by 8.3% year-on-year, but down by 23.5% from the previous month.
For January to April, Zhen Ding posted total sales of NT$44.25 billion ($1.5 billion), an increase of 20.5% compared with the same period last year.
TTM Technologies, Inc., a leading global manufacturer of technology solutions including engineered systems, radio frequency (RF) components and RF microwave/microelectronic assemblies, and printed circuit boards (PCB), reported results for the fourth quarter and fiscal 2022, which ended on January 2, 2023.
Andy Shaughnessy, Design007 Magazine
In this week leading up to Christmas, we have a little bit of everything. Pete Starkey has a review of the most recent EIPC Technical Snapshot, while Tom Kastner discusses the dwindling number of PCB companies in North America. Are we really down to 170 companies? IPC reports that North American PCB sales up 26.1% in November YOY, and the book-to-bill is dead-on at 1.00. Cybord CEO Zeev Efrat explains how his company can provide 100% component inspection. And I have an interview with a student I ran into at PCB Carolina who is working toward his “dream job” on being a technician. As Alex Barile says, he’d hate to work at a desk all day; he likes to install equipment.
Dan Beaulieu, D.B. Management Group
It’s always good to catch up with old friends, especially when you can start working together. I recently spoke with my friend John Johnson, who has joined American Standard Circuits as the director of business development. At ASC, John will be using the Averatek A-SAP process that he was previously involved with. He shares some of his background and provides insight on the best ways to use this semi-additive PCB fabrication process that opens the capability window for forming trace and space.