IPC Introduces New Committee Leader and Committee Volunteer Awards at IPC APEX EXPO 2023
February 8, 2023 | IPCEstimated reading time: 1 minute
In keeping with its commitment to showing appreciation for its strong volunteer community, IPC introduced two new awards in IPC standards development at IPC APEX EXPO 2023. The awards, Committee Leader of the Year and Volunteer of the Year, were named in honor of key leaders and volunteers from IPC standards development efforts. The Hillman-Lambert Award, named for IPC Hall of Famers and longtime standards committee volunteers David Hillman and Leo Lambert, is awarded to volunteers of the year. The Goldman-Kessler Award, named for IPC Hall of Famers, and longtime committee leaders, Patty Goldman and Bernie Kessler, is awarded to leaders of the year.
Nominations for the 2023 awards were open to all volunteers and leaders whose groups had completed their standards projects between October 2021 and October 2022. The awards were peer-selected, and a nomination committee was formed to review and judge all nomination packets.
The Hillman-Lambert Award was presented to Michael Ford, Aegis Software, and Christina Rutherford, Honeywell International, as the result of a tie vote. Ford received his nomination for his work with the 2-12c Cybersecurity Protection Standard Task Group. Rutherford was nominated for her work with the 7-31f IPC/WHMA-A-620 Task Group.
The Goldman-Kessler Award was presented to Bob Cooke, NASA Johnson Space Center. Cooke was nominated for his leadership of the 7-31k Wire Harness Design Task Group and the 5-24g Polymerics Standard Task Group.
In addition to Ford and Rutherford, nominees for the Hillman-Lambert Award included Erika Crandall, TE Connectivity; Hermann Eicher, EPT Guglhoer GmbH; Joseph Kane, BAE Systems; Garry McGuire, NASA Marshall Space Flight Center; Zhiqian Sang, Hangzhou Dianzi University; and Wei Wang, New HC3 Technologies Co., Ltd.
In addition to Cooke, nominees for the Goldman-Kessler Award were: Scott Bowles, Lockheed Martin; Constantino Gonzalez, Acme Training and Consulting; Thomas Marktscheffel, ASMPT GmbH & Co. KG; and Victor Xu, Huawei Technologies Co., Ltd.
“Volunteerism is the bedrock of our standards development activities,” said Teresa Rowe, IPC senior director, assembly and standards technology. “The new standards development committee awards program is entirely volunteer-driven, created to recognize the best-of-the-best in our standards development activities.”
Committee Leader and Volunteer of the Year awards will be presented on an annual basis, with next presentation taking place at IPC APEX EXPO 2024 in Anaheim, California.
Suggested Items
Real Time with… IPC APEX EXPO 2024: My Role as a Technology Solutions Director
05/02/2024 | Real Time with...IPC APEX EXPOPeter Tranitz, senior director of technology solutions at IPC, shares insights into his role as the design initiative lead. He details his advocacy work, industry support, and the responsibilities of the design initiative committee. The conversation also covers the revamping of standards, the IPC Design Competition, and the implementation of design rules in software tools.
HQ NextPCB of HQ Electronics Debut on the International Stage for Electronics Manufacture at IPC APEX 2024
05/01/2024 | PRNewswireHQ NextPCB of HQ Electronics, a leading Chinese-based multilayer PCB manufacturer and assembly house showcased its industrial prowess on the international stage for the first time at the IPC APEX Expo 2024.
IPC's Vision for Empowering PCB Design Engineers
04/30/2024 | Robert Erickson, IPCAs architects of innovation, printed circuit board designers are tasked with translating increasingly complex concepts into tangible designs that power our modern world. IPC provides the necessary community, standards framework, and education to prepare these pioneers as they explore the boundaries of what’s possible, equipping engineers with the knowledge, skills, and resources required to thrive in an increasingly dynamic field.
North American EMS Industry Down 4% in March
04/29/2024 | IPCIPC announced the March 2024 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.31.
Real Time with… IPC APEX EXPO 2024: A Global Presence in PCB Manufacturing
04/29/2024 | Real Time with...IPC APEX EXPORob DiGiovanni, VP of sales for the Americas at STARTEAM Global, discusses the company's global presence in PCB manufacturing. As he explains, the firm operates facilities across Europe, Asia, and North America, specializing in serving contract manufacturers in the automotive and medical industries. They emphasize quality and meeting OEM standards, focusing on offshore supply and non-Chinese factories in the North American market. The company has grown through acquisitions and rebranding to offer multiple products.