Flexiramics Reaches Breakthrough in Thermal Conductivity
May 13, 2022 | PRWEBEstimated reading time: 1 minute
Flexiramics B.V. is pleased to announce that their Flexiramics-E thin film products have reached a bulk thermal conductivity of 1.8 W/mK in the Z-direction. This breakthrough result makes the thermal conductivity of Flexiramics-E thin film twice as high as any other thin film available on the market today.
Flexiramics-E prevents sub-optimal performance of electronic components
Integration and microelectronic packaging technology are causing the power density of electronic components to increase, while their dimensions and those of electronic devices are getting smaller and miniaturized. This causes the generated heat to rapidly accumulate, thus resulting in sub-optimal performance of electronic components. Therefore, the heat dissipation of electronic components has evolved into a major focus of current electronic components and electronic device manufacturing.
Thermal conductivity compared
The thermal conductivity of the circuit boards is particularly low for flexible substrates, and this remains a critical bottleneck regarding improved heat dissipation. Especially in the out of plane (Z) direction. Most commercially available materials have a Tc between 0.2 and 0.8 W/mK in the Z-direction. Flexiramics-E thin polymer films have achieved 1.8 W/mK in the Z-direction. And future generations can achieve even higher values. As additional benefits, Flexiramics-E thin polymer films exhibit significantly increased dimensional stability in thermal cycling thanks to lower CTE vs. pure polymer.
Suggested Items
Argonne, Toyota Collaborate on Cutting-Edge Battery Recycling Process
05/01/2024 | BUSINESS WIREThe U.S. Department of Energy’s (DOE) Argonne National Laboratory has recently launched a collaboration with Toyota Motor North America that could reduce the nation’s reliance on foreign sources of battery materials.
Europlacer Presents New Range of iineo SMT Placement Machines.
05/01/2024 | EuroplacerFor more than 15 years, the Europlacer iineo placement machines have made their mark on the SMT industry with unique features and unrivalled flexibility. Today, Europlacer announces the launch of the second generation iineo.
IPC's Vision for Empowering PCB Design Engineers
04/30/2024 | Robert Erickson, IPCAs architects of innovation, printed circuit board designers are tasked with translating increasingly complex concepts into tangible designs that power our modern world. IPC provides the necessary community, standards framework, and education to prepare these pioneers as they explore the boundaries of what’s possible, equipping engineers with the knowledge, skills, and resources required to thrive in an increasingly dynamic field.
Koh Young Extends Invitation to the 2024 IEEE Electronic Components and Technology Conference
04/30/2024 | Koh YoungKoh Young, the industry leader in True3D measurement-based inspection solutions, invites you to join us at the at the 2024 IEEE Electronic Components and Technology Conference from May 28-31, 2024, in Denver, Colorado at the Gaylord Rockies Resort & Convention Center.
Latest Test and Inspection Solutions from GOEPEL electronic at SMTconnect 2024
04/29/2024 | GOEPEL electronicGOEPEL electronic will be demonstrating automated test and inspection equipment at SMTconnect, taking place in Nuremberg from June 11 to 13, 2024.