Latest News

Innovative Organic Foils for Remote Analysis of Chemical Compositions
06/08/2017 | Technische Universität Dresden
June Issue of The PCB Magazine Available Now
06/07/2017 | I-Connect007
FPCB Maker Flexium Reports Nearly 5% YoY Growth in May Sales
06/07/2017 | Stephen Las Marias, I-Connect007
UL-Certification for Ventec’s IMS Products Extended to Alternative Copper-Base Options
06/07/2017 | Ventec
MacDermid Enthone to Exhibit at JPCA
06/06/2017 | MacDermid Enthone Electronics Solutions
Eltek Appoints Kathy Nargi-Toth as President of Eltek USA Inc.
06/06/2017 | Eltek
Shengyi Technology Approved as Authorized Lab by UL
06/05/2017 | Shengyi Technology Co.
IPC Releases PCB Industry Results for April 2017
06/05/2017 | IPC
AT&S: Change in the Management Board
06/02/2017 | AT&S
Meyer Burger Supplies CONx Microfab R&D and Pilot Production System at NextFlex
06/02/2017 | Meyer Burger
Isola Exhibits RF/Microwave Laminates at International Microwave Symposium (IMS) in Honolulu
06/01/2017 | Isola
Dave Rund Joins Pluritec’s EcoSpray Team
06/01/2017 | Pluritec
Intrinsiq Materials and NovaCentrix Unveil Ultra-Thin Printed Copper-Clad Polyimide using Photonic Sintering for HDI Applications
05/31/2017 | Intrinsiq Materials Inc.
Engineers Develop Innovative Direct Patterning Plating Technology
05/31/2017 | ACN Newswire
Summit Interconnect Names Doug A. Scrimes VP and GM of Anaheim Division
05/30/2017 | Summit Interconnect, Inc.
CHPT Targeting Special-purpose PCBs
05/30/2017 | Digitimes
Flexible PCB Market Industry Trends and Developments
05/26/2017 | SAT Press Releases
Flex and Flex-Rigid Printed Circuits Market Analysis
05/26/2017 | openPR
IPC Discusses Workforce Development Issues With U.S. Policymakers
05/26/2017 | IPC
Eltek Inks Distribution Agreement with NCAB Group Italy
05/25/2017 | PRNewswire
Printed, Flexible and Rechargeable Battery Can Power Wearable Sensors
05/25/2017 | University of California San Diego
Global PCB Market Expected to Reach an Estimated $72.6 Billion by 2022
05/25/2017 | PRNewswire
How Scientists Turned a Flag Into a Loudspeaker
05/24/2017 | Michigan State University
Uyemura Expands US Pacific Rim Service Capacity
05/24/2017 | Uyemura
SMTA, iNEMI, MEPTEC Seek Presenters for 2018 Medical Electronics Symposium
05/24/2017 | SMTA
Ventec International’s Thomas Michels to Speak at the EIPC Summer Conference
05/23/2017 | Ventec International Group
Orbotech Presents mSAP-Enabling PCB Production Solutions for Advanced HDI at CTEX 2017
05/19/2017 | Orbotech
Conductive Paper Could Enable Future Flexible Electronics
05/18/2017 | ACS
Sierra Proto Express Installs atg S-Technology Flying Probe System for HDI Electrical Test
05/18/2017 | atg Luther & Maelzer GmbH
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