EPTE Newsletter: Internepcon Japan 2020

The largest electronics exhibition in Asia opened January 15 at Tokyo Big Sight. The three-day event was larger than last year with more trade show participants as well as visitors. However, the trade show was not on the main floor this year. Tokyo Big Sight is now home to media that is covering the 2020 Summer Olympics, and hundreds of exhibitions and conventions will have to cancel or change venues.

Internepcon Japan 2020 was somewhat displaced, and the show was divided among the different halls at Tokyo Big Sight. This was an inconvenience for visitors, and it was nearly impossible to visit all booths during the event. I decided to focus my attention on a few select companies due to logistics and a time constraint. The most popular trade show booths were affiliated with car electronics, ultra-high density, wearable devices, and 5G ultra-wideband.

Fine pattern generation is an ongoing project for printed circuit manufacturers. Chemical suppliers JCU and Okuno demonstrated line pitches less than 5 microns produced through a semi-additive process. These processes can generate one-micron traces, but circuit manufacturers are not ready to use the ultra-fine circuits. Current assembling processes and connection technologies that use soldering and wire bonding are not capable of using ultra-fine traces. Compass, a tape shape flex circuit manufacturer in Hong Kong, displayed finer traces than 15 microns designed for driver modules for display devices and double-sided chip-on-film (COF) with microvia holes produced reel-to-reel manufacturing process.

Low-loss materials for high-frequency circuits are an ongoing design project. American laminate suppliers Rogers and Nelco dominate the market for rigid circuit boards. Liquid crystal polymer (LCP) film is leading the flex circuit industry. New low-loss materials—such as low-loss polyimide film, fluoropolymer resins, and PEEK resin—are looking for second positions. One problem is the high cost. 

nepcon_japan-2020-650.jpg

P-ban.com, an online printed circuit supplier, displayed various products, including multi-layer rigid boards, flexible circuits, and rigid-flex. One of their main features is a series of flexible thick-film circuits produced by a screen-printing process, with fine line circuits down to 30-micron line/space. The company also displayed monocoque circuits, a unique hybrid 3D circuit produced by thick film technology.                

Chinese circuit manufacturers and distributors continue to increase their presence at these trade shows. Most of them claimed they are capable of supplying a broad range of circuit products, including rigid, flex, and rigid-flex. They provided snapshots of their manufacturing plants in China. I was impressed with their buildings and manufacturing equipment; most of their facilities looked better than circuit manufacturers in the U.S. and Japan.

The Chinese manufacturers also displayed typical examples of the circuits. The quality levels of the samples were not on par with Taiwanese and Korean manufacturers. It may take a few more years for them to catch up and have an equivalent quality level.

Headlines

1. Nikkei Electronics (industrial media in Japan) 1/20

Organic EL will be major instead of LCD displays in 2020. followed by micro-LEDs.

2. NTT East Japan (telecommunication provider in Japan) 1/22

Made JV NTTe-Sports to strengthen the services in the globally growing market.

3. YAMAHA Motors (motorcycle manufacturer in Japan) 1/21

Will enter the robot market cooperating Waseda University targeting at least 5% market share.

4. Panasonic (electronics company in Japan) 1/22

Has been developing a series of VR simulators to realize the human-machine interface (HMI) systems.

5. ZTE (telecommunication provider in China) 1/21

Launched the first 5G SA network in Eastern Africa cooperating with MTN Uganda.

6. Renault (car manufacturer in France) 1/22

Kicked off the R&D project “INCIT-EV” with 32 companies to develop EV-relating technologies.

7. Toshiba D&S (semiconductor company in Japan) 1/23

Commercialized small-size MOSFET devices for automobile applications introducing TSOP6F that reduce SMT space 70%.

8. Dai-Nippon Printing (printing company) 1/23

Developed a thin heat sink device “paper chamber” for 5G smartphones (thickness: 0.25 mm), which will generate more spaces for batteries.

9. Sharp (electronics company in Japan) 1/23

Unveiled a 70” touch panel screen “PN-CD701” for conference room use. It will start to ship in March (standard retail price: 1,030,000 yen).

10. AIST (R&D organization in Japan) 1/24

Developed a thermo-couple device based on organic material PEDOT/PSS that works under low temperatures (120°C).

11. Mitsubishi UFJ Bank (bank in Japan) 1/27

Has been introducing arm-type robots to complete the automation of office work.

12. Fujitsu (electronics company in Japan) 12/2

Started the shipment of the supercomputer “FUGAKU” that has a 100x higher speed compared to the previous machine “KEI.”

13. Toshiba (electric and electronics company in Japan) 12/6

Developed a cancer diagnosis system. A drop of blood is enough to detect 13 kinds of cancer with 99% accuracy, analyzing micro-RNAs in two hours.

14. SMK (component supplier in Japan) 12/10

Commercialized a BtB connector series “PB-F2” for floating circuit boards of automobile applications. Volume production will start in April 2010.

15. Panasonic (electronics company in Japan) 12/10

Agreed with Nishikawa, bedding product supplier, to start support service in March 2020 for comfortable sleeping.

16. Asics (sportswear supplier in Japan) 12/11

Co-developed a low-cost, wearable motion capture suite with Tokyo University for analysis of various sports.

17. MinebeaMitsumi (device manufacturer in Japan) 12/12

Co-developed a stepping motor with high precision with Renesas Electronics for robots, OA equipment, medical devices, and more.

18. TE Japan (connector manufacturer in Japan) 12/12

Commercialized a high-reliability connector series “SFP + Stack Type Dual Line Connectors” for high-speed, double-sided printed circuits.

19. Toshiba Device and Storage (semiconductor manufacturer in Japan) 12/12

Commercialized a system power source IC “TB9045FNG” for automobile modules.

20. TDK (component supplier in Japan) 12/12

Commercialized a noise suppression filter “MAF1608GAD-L Type” with high efficiency for smart speakers or tablet PCs.

21. Taiyo Yuden (component supplier in Japan) 12/15

Developed the all-solid-state lithium secondly battery with SMT package utilizing multilayer ceramic capacitor technologies (size: 1005 ~ 4532).

22. Murata (component supplier in Japan) 12/15

Developed the smallest chip capacitor (0.25 x 0.125 x 0.125 mm for 0.1 micro-Farads). Volume production will start in 2020.

Dominique K. Numakura is the managing director of DKN Research LLC. Contact haverhill@dknreseach.com for further information and news.

Back

2020

EPTE Newsletter: Internepcon Japan 2020

01-30-2020

The largest electronics exhibition in Asia opened January 15 at Tokyo Big Sight. The three-day event was larger than last year with more trade show participants as well as visitors. Dominique Numakura shares highlights from the show floor.

View Story

EPTE Newsletter: Electroless Plating for Flexible Circuits

01-24-2020

Electroless plating is a popular method in manufacturing printed circuits or flexible circuits. The electroless plating concept is not new; it is used to protect conductors against oxidation. However, it is not the default process for printed circuit manufacturing. Dominique Numakura explains.

View Story
Back

2019

EPTE Newsletter: Internepcon Japan 2020

01-30-2020

The largest electronics exhibition in Asia opened January 15 at Tokyo Big Sight. The three-day event was larger than last year with more trade show participants as well as visitors. Dominique Numakura shares highlights from the show floor.

View Story

EPTE Newsletter: Electroless Plating for Flexible Circuits

01-24-2020

Electroless plating is a popular method in manufacturing printed circuits or flexible circuits. The electroless plating concept is not new; it is used to protect conductors against oxidation. However, it is not the default process for printed circuit manufacturing. Dominique Numakura explains.

View Story
Back

2018

EPTE Newsletter: Sputtering or Chemical Plating?

12-24-2018

More than 20 years ago, material manufacturers competed with each other to develop adhesiveless copper-clad laminates for the next generation of flexible circuits. A dozen or so companies were leaders in the pack with their new technologies. These technologies were categorized into two types: a casting and laminating process, and the metallization of polyimide films.

View Story

EPTE Newsletter: Exotic Materials for Flexible Circuits

11-29-2018

Wearable technology is common in the electronics industry and is expected to be a profitable category for the next generation of electronics. An Amazon search for wearable technology leads to 30,000 results. Flexible circuits are the most significant packaging materials for wearable devices including medical and healthcare devices.

View Story

EPTE Newsletter: Hiccup for Taiwanese Electronics Industry?

10-24-2018

Shipments for the PCB industry during the Q2 and the beginning of Q3 came in at double-digit growth, and revenue for August increased by more than 13% compared to the same month last year. Manufacturers throughout the mobile device supply chain predicted sales would increase even more during Q4.

View Story

EPTE Newsletter: Taiwan Electronics are Heating Up (Figuratively)

10-15-2018

Dominique Numakura considers electronics manufacturing in Taiwan to be the barometer for the global consumer electronics industry. Market trends can be predicted by analyzing shipping data from Taiwanese circuit board manufacturers. Annual volume increases every year, despite slow monthly cycles.

View Story

EPTE Newsletter: New Materials for Wearable Electronics

09-20-2018

Technology continues to evolve, and wearable electronics are the focal point for many new concepts. The next generation of wearable products for the consumer electronics industry will create a new market with nothing but upside for manufacturers and suppliers.

View Story

EPTE Newsletter: Thinner and Lighter Printed Circuits

09-03-2018

Manufacturers from the electronics industry consistently compete to create higher density circuits. Cutting edge semiconductor manufacturers can generate less than 10 nanometer traces on silicon chips.

View Story

EPTE Newsletter: Flexible Metal Laminates Made With Chemical Processes

08-28-2018

DKN Research is fielding many inquiries about a semi-additive process for the fine-line generation on thin, flexible substrates, including transparent heat-resistant plastic films. Most inquiries are from chip-on-film (COF) manufacturers with reel-to-reel (RTR) processes.

View Story

EPTE Newsletter: Flood Catastrophe in Japan

07-18-2018

The rainy season in Japan usually ends in early July; however, severe and abnormal weather plagued Japan during the entire month this year. First, a strong typhoon passing from south to north soaked the western island, Kyushu. The typhoon kicked off the seasonal rain front in the western half of Japan, which resulted in historical rainfall. Some areas received more than 1,000 millimeters of rain in less than four days—a record amount of rainfall for many towns.

View Story

EPTE Newsletter: Metallization for Plastic Surfaces

07-13-2018

During the 1980s, manufacturers ran around the barn a few times trying to decide the best way to produce reliable bond strength between polyimide sheets and copper foils when producing thin copper laminates for high-density flexible circuits.

View Story

EPTE Newsletter: JPCA SHOW 2018

06-15-2018

One of the largest exhibitions for the printed circuit industry was held June 6–8 at Tokyo Big Sight in Japan. The three-day show is held in Tokyo every June and attracts a worldwide audience. This year, related events at the show included JIEP 2018, JISSO PROTEC 2018, Total Organic Expo 2018, WIRE Japan Show 2018 and Smart Sensing 2018.

View Story
Back

2017

EPTE Newsletter: Sputtering or Chemical Plating?

12-24-2018

More than 20 years ago, material manufacturers competed with each other to develop adhesiveless copper-clad laminates for the next generation of flexible circuits. A dozen or so companies were leaders in the pack with their new technologies. These technologies were categorized into two types: a casting and laminating process, and the metallization of polyimide films.

View Story

EPTE Newsletter: Exotic Materials for Flexible Circuits

11-29-2018

Wearable technology is common in the electronics industry and is expected to be a profitable category for the next generation of electronics. An Amazon search for wearable technology leads to 30,000 results. Flexible circuits are the most significant packaging materials for wearable devices including medical and healthcare devices.

View Story

EPTE Newsletter: Hiccup for Taiwanese Electronics Industry?

10-24-2018

Shipments for the PCB industry during the Q2 and the beginning of Q3 came in at double-digit growth, and revenue for August increased by more than 13% compared to the same month last year. Manufacturers throughout the mobile device supply chain predicted sales would increase even more during Q4.

View Story

EPTE Newsletter: Taiwan Electronics are Heating Up (Figuratively)

10-15-2018

Dominique Numakura considers electronics manufacturing in Taiwan to be the barometer for the global consumer electronics industry. Market trends can be predicted by analyzing shipping data from Taiwanese circuit board manufacturers. Annual volume increases every year, despite slow monthly cycles.

View Story

EPTE Newsletter: New Materials for Wearable Electronics

09-20-2018

Technology continues to evolve, and wearable electronics are the focal point for many new concepts. The next generation of wearable products for the consumer electronics industry will create a new market with nothing but upside for manufacturers and suppliers.

View Story

EPTE Newsletter: Thinner and Lighter Printed Circuits

09-03-2018

Manufacturers from the electronics industry consistently compete to create higher density circuits. Cutting edge semiconductor manufacturers can generate less than 10 nanometer traces on silicon chips.

View Story

EPTE Newsletter: Flexible Metal Laminates Made With Chemical Processes

08-28-2018

DKN Research is fielding many inquiries about a semi-additive process for the fine-line generation on thin, flexible substrates, including transparent heat-resistant plastic films. Most inquiries are from chip-on-film (COF) manufacturers with reel-to-reel (RTR) processes.

View Story

EPTE Newsletter: Flood Catastrophe in Japan

07-18-2018

The rainy season in Japan usually ends in early July; however, severe and abnormal weather plagued Japan during the entire month this year. First, a strong typhoon passing from south to north soaked the western island, Kyushu. The typhoon kicked off the seasonal rain front in the western half of Japan, which resulted in historical rainfall. Some areas received more than 1,000 millimeters of rain in less than four days—a record amount of rainfall for many towns.

View Story

EPTE Newsletter: Metallization for Plastic Surfaces

07-13-2018

During the 1980s, manufacturers ran around the barn a few times trying to decide the best way to produce reliable bond strength between polyimide sheets and copper foils when producing thin copper laminates for high-density flexible circuits.

View Story

EPTE Newsletter: JPCA SHOW 2018

06-15-2018

One of the largest exhibitions for the printed circuit industry was held June 6–8 at Tokyo Big Sight in Japan. The three-day show is held in Tokyo every June and attracts a worldwide audience. This year, related events at the show included JIEP 2018, JISSO PROTEC 2018, Total Organic Expo 2018, WIRE Japan Show 2018 and Smart Sensing 2018.

View Story
Back

2016

EPTE Newsletter: Sputtering or Chemical Plating?

12-24-2018

More than 20 years ago, material manufacturers competed with each other to develop adhesiveless copper-clad laminates for the next generation of flexible circuits. A dozen or so companies were leaders in the pack with their new technologies. These technologies were categorized into two types: a casting and laminating process, and the metallization of polyimide films.

View Story

EPTE Newsletter: Exotic Materials for Flexible Circuits

11-29-2018

Wearable technology is common in the electronics industry and is expected to be a profitable category for the next generation of electronics. An Amazon search for wearable technology leads to 30,000 results. Flexible circuits are the most significant packaging materials for wearable devices including medical and healthcare devices.

View Story

EPTE Newsletter: Hiccup for Taiwanese Electronics Industry?

10-24-2018

Shipments for the PCB industry during the Q2 and the beginning of Q3 came in at double-digit growth, and revenue for August increased by more than 13% compared to the same month last year. Manufacturers throughout the mobile device supply chain predicted sales would increase even more during Q4.

View Story

EPTE Newsletter: Taiwan Electronics are Heating Up (Figuratively)

10-15-2018

Dominique Numakura considers electronics manufacturing in Taiwan to be the barometer for the global consumer electronics industry. Market trends can be predicted by analyzing shipping data from Taiwanese circuit board manufacturers. Annual volume increases every year, despite slow monthly cycles.

View Story

EPTE Newsletter: New Materials for Wearable Electronics

09-20-2018

Technology continues to evolve, and wearable electronics are the focal point for many new concepts. The next generation of wearable products for the consumer electronics industry will create a new market with nothing but upside for manufacturers and suppliers.

View Story

EPTE Newsletter: Thinner and Lighter Printed Circuits

09-03-2018

Manufacturers from the electronics industry consistently compete to create higher density circuits. Cutting edge semiconductor manufacturers can generate less than 10 nanometer traces on silicon chips.

View Story

EPTE Newsletter: Flexible Metal Laminates Made With Chemical Processes

08-28-2018

DKN Research is fielding many inquiries about a semi-additive process for the fine-line generation on thin, flexible substrates, including transparent heat-resistant plastic films. Most inquiries are from chip-on-film (COF) manufacturers with reel-to-reel (RTR) processes.

View Story

EPTE Newsletter: Flood Catastrophe in Japan

07-18-2018

The rainy season in Japan usually ends in early July; however, severe and abnormal weather plagued Japan during the entire month this year. First, a strong typhoon passing from south to north soaked the western island, Kyushu. The typhoon kicked off the seasonal rain front in the western half of Japan, which resulted in historical rainfall. Some areas received more than 1,000 millimeters of rain in less than four days—a record amount of rainfall for many towns.

View Story

EPTE Newsletter: Metallization for Plastic Surfaces

07-13-2018

During the 1980s, manufacturers ran around the barn a few times trying to decide the best way to produce reliable bond strength between polyimide sheets and copper foils when producing thin copper laminates for high-density flexible circuits.

View Story

EPTE Newsletter: JPCA SHOW 2018

06-15-2018

One of the largest exhibitions for the printed circuit industry was held June 6–8 at Tokyo Big Sight in Japan. The three-day show is held in Tokyo every June and attracts a worldwide audience. This year, related events at the show included JIEP 2018, JISSO PROTEC 2018, Total Organic Expo 2018, WIRE Japan Show 2018 and Smart Sensing 2018.

View Story
Back

2015

EPTE Newsletter: Sputtering or Chemical Plating?

12-24-2018

More than 20 years ago, material manufacturers competed with each other to develop adhesiveless copper-clad laminates for the next generation of flexible circuits. A dozen or so companies were leaders in the pack with their new technologies. These technologies were categorized into two types: a casting and laminating process, and the metallization of polyimide films.

View Story

EPTE Newsletter: Exotic Materials for Flexible Circuits

11-29-2018

Wearable technology is common in the electronics industry and is expected to be a profitable category for the next generation of electronics. An Amazon search for wearable technology leads to 30,000 results. Flexible circuits are the most significant packaging materials for wearable devices including medical and healthcare devices.

View Story

EPTE Newsletter: Hiccup for Taiwanese Electronics Industry?

10-24-2018

Shipments for the PCB industry during the Q2 and the beginning of Q3 came in at double-digit growth, and revenue for August increased by more than 13% compared to the same month last year. Manufacturers throughout the mobile device supply chain predicted sales would increase even more during Q4.

View Story

EPTE Newsletter: Taiwan Electronics are Heating Up (Figuratively)

10-15-2018

Dominique Numakura considers electronics manufacturing in Taiwan to be the barometer for the global consumer electronics industry. Market trends can be predicted by analyzing shipping data from Taiwanese circuit board manufacturers. Annual volume increases every year, despite slow monthly cycles.

View Story

EPTE Newsletter: New Materials for Wearable Electronics

09-20-2018

Technology continues to evolve, and wearable electronics are the focal point for many new concepts. The next generation of wearable products for the consumer electronics industry will create a new market with nothing but upside for manufacturers and suppliers.

View Story

EPTE Newsletter: Thinner and Lighter Printed Circuits

09-03-2018

Manufacturers from the electronics industry consistently compete to create higher density circuits. Cutting edge semiconductor manufacturers can generate less than 10 nanometer traces on silicon chips.

View Story

EPTE Newsletter: Flexible Metal Laminates Made With Chemical Processes

08-28-2018

DKN Research is fielding many inquiries about a semi-additive process for the fine-line generation on thin, flexible substrates, including transparent heat-resistant plastic films. Most inquiries are from chip-on-film (COF) manufacturers with reel-to-reel (RTR) processes.

View Story

EPTE Newsletter: Flood Catastrophe in Japan

07-18-2018

The rainy season in Japan usually ends in early July; however, severe and abnormal weather plagued Japan during the entire month this year. First, a strong typhoon passing from south to north soaked the western island, Kyushu. The typhoon kicked off the seasonal rain front in the western half of Japan, which resulted in historical rainfall. Some areas received more than 1,000 millimeters of rain in less than four days—a record amount of rainfall for many towns.

View Story

EPTE Newsletter: Metallization for Plastic Surfaces

07-13-2018

During the 1980s, manufacturers ran around the barn a few times trying to decide the best way to produce reliable bond strength between polyimide sheets and copper foils when producing thin copper laminates for high-density flexible circuits.

View Story

EPTE Newsletter: JPCA SHOW 2018

06-15-2018

One of the largest exhibitions for the printed circuit industry was held June 6–8 at Tokyo Big Sight in Japan. The three-day show is held in Tokyo every June and attracts a worldwide audience. This year, related events at the show included JIEP 2018, JISSO PROTEC 2018, Total Organic Expo 2018, WIRE Japan Show 2018 and Smart Sensing 2018.

View Story
Back

2014

EPTE Newsletter: Sputtering or Chemical Plating?

12-24-2018

More than 20 years ago, material manufacturers competed with each other to develop adhesiveless copper-clad laminates for the next generation of flexible circuits. A dozen or so companies were leaders in the pack with their new technologies. These technologies were categorized into two types: a casting and laminating process, and the metallization of polyimide films.

View Story

EPTE Newsletter: Exotic Materials for Flexible Circuits

11-29-2018

Wearable technology is common in the electronics industry and is expected to be a profitable category for the next generation of electronics. An Amazon search for wearable technology leads to 30,000 results. Flexible circuits are the most significant packaging materials for wearable devices including medical and healthcare devices.

View Story

EPTE Newsletter: Hiccup for Taiwanese Electronics Industry?

10-24-2018

Shipments for the PCB industry during the Q2 and the beginning of Q3 came in at double-digit growth, and revenue for August increased by more than 13% compared to the same month last year. Manufacturers throughout the mobile device supply chain predicted sales would increase even more during Q4.

View Story

EPTE Newsletter: Taiwan Electronics are Heating Up (Figuratively)

10-15-2018

Dominique Numakura considers electronics manufacturing in Taiwan to be the barometer for the global consumer electronics industry. Market trends can be predicted by analyzing shipping data from Taiwanese circuit board manufacturers. Annual volume increases every year, despite slow monthly cycles.

View Story

EPTE Newsletter: New Materials for Wearable Electronics

09-20-2018

Technology continues to evolve, and wearable electronics are the focal point for many new concepts. The next generation of wearable products for the consumer electronics industry will create a new market with nothing but upside for manufacturers and suppliers.

View Story

EPTE Newsletter: Thinner and Lighter Printed Circuits

09-03-2018

Manufacturers from the electronics industry consistently compete to create higher density circuits. Cutting edge semiconductor manufacturers can generate less than 10 nanometer traces on silicon chips.

View Story

EPTE Newsletter: Flexible Metal Laminates Made With Chemical Processes

08-28-2018

DKN Research is fielding many inquiries about a semi-additive process for the fine-line generation on thin, flexible substrates, including transparent heat-resistant plastic films. Most inquiries are from chip-on-film (COF) manufacturers with reel-to-reel (RTR) processes.

View Story

EPTE Newsletter: Flood Catastrophe in Japan

07-18-2018

The rainy season in Japan usually ends in early July; however, severe and abnormal weather plagued Japan during the entire month this year. First, a strong typhoon passing from south to north soaked the western island, Kyushu. The typhoon kicked off the seasonal rain front in the western half of Japan, which resulted in historical rainfall. Some areas received more than 1,000 millimeters of rain in less than four days—a record amount of rainfall for many towns.

View Story

EPTE Newsletter: Metallization for Plastic Surfaces

07-13-2018

During the 1980s, manufacturers ran around the barn a few times trying to decide the best way to produce reliable bond strength between polyimide sheets and copper foils when producing thin copper laminates for high-density flexible circuits.

View Story

EPTE Newsletter: JPCA SHOW 2018

06-15-2018

One of the largest exhibitions for the printed circuit industry was held June 6–8 at Tokyo Big Sight in Japan. The three-day show is held in Tokyo every June and attracts a worldwide audience. This year, related events at the show included JIEP 2018, JISSO PROTEC 2018, Total Organic Expo 2018, WIRE Japan Show 2018 and Smart Sensing 2018.

View Story
Back

2013

EPTE Newsletter: Sputtering or Chemical Plating?

12-24-2018

More than 20 years ago, material manufacturers competed with each other to develop adhesiveless copper-clad laminates for the next generation of flexible circuits. A dozen or so companies were leaders in the pack with their new technologies. These technologies were categorized into two types: a casting and laminating process, and the metallization of polyimide films.

View Story

EPTE Newsletter: Exotic Materials for Flexible Circuits

11-29-2018

Wearable technology is common in the electronics industry and is expected to be a profitable category for the next generation of electronics. An Amazon search for wearable technology leads to 30,000 results. Flexible circuits are the most significant packaging materials for wearable devices including medical and healthcare devices.

View Story

EPTE Newsletter: Hiccup for Taiwanese Electronics Industry?

10-24-2018

Shipments for the PCB industry during the Q2 and the beginning of Q3 came in at double-digit growth, and revenue for August increased by more than 13% compared to the same month last year. Manufacturers throughout the mobile device supply chain predicted sales would increase even more during Q4.

View Story

EPTE Newsletter: Taiwan Electronics are Heating Up (Figuratively)

10-15-2018

Dominique Numakura considers electronics manufacturing in Taiwan to be the barometer for the global consumer electronics industry. Market trends can be predicted by analyzing shipping data from Taiwanese circuit board manufacturers. Annual volume increases every year, despite slow monthly cycles.

View Story

EPTE Newsletter: New Materials for Wearable Electronics

09-20-2018

Technology continues to evolve, and wearable electronics are the focal point for many new concepts. The next generation of wearable products for the consumer electronics industry will create a new market with nothing but upside for manufacturers and suppliers.

View Story

EPTE Newsletter: Thinner and Lighter Printed Circuits

09-03-2018

Manufacturers from the electronics industry consistently compete to create higher density circuits. Cutting edge semiconductor manufacturers can generate less than 10 nanometer traces on silicon chips.

View Story

EPTE Newsletter: Flexible Metal Laminates Made With Chemical Processes

08-28-2018

DKN Research is fielding many inquiries about a semi-additive process for the fine-line generation on thin, flexible substrates, including transparent heat-resistant plastic films. Most inquiries are from chip-on-film (COF) manufacturers with reel-to-reel (RTR) processes.

View Story

EPTE Newsletter: Flood Catastrophe in Japan

07-18-2018

The rainy season in Japan usually ends in early July; however, severe and abnormal weather plagued Japan during the entire month this year. First, a strong typhoon passing from south to north soaked the western island, Kyushu. The typhoon kicked off the seasonal rain front in the western half of Japan, which resulted in historical rainfall. Some areas received more than 1,000 millimeters of rain in less than four days—a record amount of rainfall for many towns.

View Story

EPTE Newsletter: Metallization for Plastic Surfaces

07-13-2018

During the 1980s, manufacturers ran around the barn a few times trying to decide the best way to produce reliable bond strength between polyimide sheets and copper foils when producing thin copper laminates for high-density flexible circuits.

View Story

EPTE Newsletter: JPCA SHOW 2018

06-15-2018

One of the largest exhibitions for the printed circuit industry was held June 6–8 at Tokyo Big Sight in Japan. The three-day show is held in Tokyo every June and attracts a worldwide audience. This year, related events at the show included JIEP 2018, JISSO PROTEC 2018, Total Organic Expo 2018, WIRE Japan Show 2018 and Smart Sensing 2018.

View Story
Back

2012

EPTE Newsletter: Sputtering or Chemical Plating?

12-24-2018

More than 20 years ago, material manufacturers competed with each other to develop adhesiveless copper-clad laminates for the next generation of flexible circuits. A dozen or so companies were leaders in the pack with their new technologies. These technologies were categorized into two types: a casting and laminating process, and the metallization of polyimide films.

View Story

EPTE Newsletter: Exotic Materials for Flexible Circuits

11-29-2018

Wearable technology is common in the electronics industry and is expected to be a profitable category for the next generation of electronics. An Amazon search for wearable technology leads to 30,000 results. Flexible circuits are the most significant packaging materials for wearable devices including medical and healthcare devices.

View Story

EPTE Newsletter: Hiccup for Taiwanese Electronics Industry?

10-24-2018

Shipments for the PCB industry during the Q2 and the beginning of Q3 came in at double-digit growth, and revenue for August increased by more than 13% compared to the same month last year. Manufacturers throughout the mobile device supply chain predicted sales would increase even more during Q4.

View Story

EPTE Newsletter: Taiwan Electronics are Heating Up (Figuratively)

10-15-2018

Dominique Numakura considers electronics manufacturing in Taiwan to be the barometer for the global consumer electronics industry. Market trends can be predicted by analyzing shipping data from Taiwanese circuit board manufacturers. Annual volume increases every year, despite slow monthly cycles.

View Story

EPTE Newsletter: New Materials for Wearable Electronics

09-20-2018

Technology continues to evolve, and wearable electronics are the focal point for many new concepts. The next generation of wearable products for the consumer electronics industry will create a new market with nothing but upside for manufacturers and suppliers.

View Story

EPTE Newsletter: Thinner and Lighter Printed Circuits

09-03-2018

Manufacturers from the electronics industry consistently compete to create higher density circuits. Cutting edge semiconductor manufacturers can generate less than 10 nanometer traces on silicon chips.

View Story

EPTE Newsletter: Flexible Metal Laminates Made With Chemical Processes

08-28-2018

DKN Research is fielding many inquiries about a semi-additive process for the fine-line generation on thin, flexible substrates, including transparent heat-resistant plastic films. Most inquiries are from chip-on-film (COF) manufacturers with reel-to-reel (RTR) processes.

View Story

EPTE Newsletter: Flood Catastrophe in Japan

07-18-2018

The rainy season in Japan usually ends in early July; however, severe and abnormal weather plagued Japan during the entire month this year. First, a strong typhoon passing from south to north soaked the western island, Kyushu. The typhoon kicked off the seasonal rain front in the western half of Japan, which resulted in historical rainfall. Some areas received more than 1,000 millimeters of rain in less than four days—a record amount of rainfall for many towns.

View Story

EPTE Newsletter: Metallization for Plastic Surfaces

07-13-2018

During the 1980s, manufacturers ran around the barn a few times trying to decide the best way to produce reliable bond strength between polyimide sheets and copper foils when producing thin copper laminates for high-density flexible circuits.

View Story

EPTE Newsletter: JPCA SHOW 2018

06-15-2018

One of the largest exhibitions for the printed circuit industry was held June 6–8 at Tokyo Big Sight in Japan. The three-day show is held in Tokyo every June and attracts a worldwide audience. This year, related events at the show included JIEP 2018, JISSO PROTEC 2018, Total Organic Expo 2018, WIRE Japan Show 2018 and Smart Sensing 2018.

View Story
Back

2011

EPTE Newsletter: Sputtering or Chemical Plating?

12-24-2018

More than 20 years ago, material manufacturers competed with each other to develop adhesiveless copper-clad laminates for the next generation of flexible circuits. A dozen or so companies were leaders in the pack with their new technologies. These technologies were categorized into two types: a casting and laminating process, and the metallization of polyimide films.

View Story

EPTE Newsletter: Exotic Materials for Flexible Circuits

11-29-2018

Wearable technology is common in the electronics industry and is expected to be a profitable category for the next generation of electronics. An Amazon search for wearable technology leads to 30,000 results. Flexible circuits are the most significant packaging materials for wearable devices including medical and healthcare devices.

View Story

EPTE Newsletter: Hiccup for Taiwanese Electronics Industry?

10-24-2018

Shipments for the PCB industry during the Q2 and the beginning of Q3 came in at double-digit growth, and revenue for August increased by more than 13% compared to the same month last year. Manufacturers throughout the mobile device supply chain predicted sales would increase even more during Q4.

View Story

EPTE Newsletter: Taiwan Electronics are Heating Up (Figuratively)

10-15-2018

Dominique Numakura considers electronics manufacturing in Taiwan to be the barometer for the global consumer electronics industry. Market trends can be predicted by analyzing shipping data from Taiwanese circuit board manufacturers. Annual volume increases every year, despite slow monthly cycles.

View Story

EPTE Newsletter: New Materials for Wearable Electronics

09-20-2018

Technology continues to evolve, and wearable electronics are the focal point for many new concepts. The next generation of wearable products for the consumer electronics industry will create a new market with nothing but upside for manufacturers and suppliers.

View Story

EPTE Newsletter: Thinner and Lighter Printed Circuits

09-03-2018

Manufacturers from the electronics industry consistently compete to create higher density circuits. Cutting edge semiconductor manufacturers can generate less than 10 nanometer traces on silicon chips.

View Story

EPTE Newsletter: Flexible Metal Laminates Made With Chemical Processes

08-28-2018

DKN Research is fielding many inquiries about a semi-additive process for the fine-line generation on thin, flexible substrates, including transparent heat-resistant plastic films. Most inquiries are from chip-on-film (COF) manufacturers with reel-to-reel (RTR) processes.

View Story

EPTE Newsletter: Flood Catastrophe in Japan

07-18-2018

The rainy season in Japan usually ends in early July; however, severe and abnormal weather plagued Japan during the entire month this year. First, a strong typhoon passing from south to north soaked the western island, Kyushu. The typhoon kicked off the seasonal rain front in the western half of Japan, which resulted in historical rainfall. Some areas received more than 1,000 millimeters of rain in less than four days—a record amount of rainfall for many towns.

View Story

EPTE Newsletter: Metallization for Plastic Surfaces

07-13-2018

During the 1980s, manufacturers ran around the barn a few times trying to decide the best way to produce reliable bond strength between polyimide sheets and copper foils when producing thin copper laminates for high-density flexible circuits.

View Story

EPTE Newsletter: JPCA SHOW 2018

06-15-2018

One of the largest exhibitions for the printed circuit industry was held June 6–8 at Tokyo Big Sight in Japan. The three-day show is held in Tokyo every June and attracts a worldwide audience. This year, related events at the show included JIEP 2018, JISSO PROTEC 2018, Total Organic Expo 2018, WIRE Japan Show 2018 and Smart Sensing 2018.

View Story
Back

2010

EPTE Newsletter: Sputtering or Chemical Plating?

12-24-2018

More than 20 years ago, material manufacturers competed with each other to develop adhesiveless copper-clad laminates for the next generation of flexible circuits. A dozen or so companies were leaders in the pack with their new technologies. These technologies were categorized into two types: a casting and laminating process, and the metallization of polyimide films.

View Story

EPTE Newsletter: Exotic Materials for Flexible Circuits

11-29-2018

Wearable technology is common in the electronics industry and is expected to be a profitable category for the next generation of electronics. An Amazon search for wearable technology leads to 30,000 results. Flexible circuits are the most significant packaging materials for wearable devices including medical and healthcare devices.

View Story

EPTE Newsletter: Hiccup for Taiwanese Electronics Industry?

10-24-2018

Shipments for the PCB industry during the Q2 and the beginning of Q3 came in at double-digit growth, and revenue for August increased by more than 13% compared to the same month last year. Manufacturers throughout the mobile device supply chain predicted sales would increase even more during Q4.

View Story

EPTE Newsletter: Taiwan Electronics are Heating Up (Figuratively)

10-15-2018

Dominique Numakura considers electronics manufacturing in Taiwan to be the barometer for the global consumer electronics industry. Market trends can be predicted by analyzing shipping data from Taiwanese circuit board manufacturers. Annual volume increases every year, despite slow monthly cycles.

View Story

EPTE Newsletter: New Materials for Wearable Electronics

09-20-2018

Technology continues to evolve, and wearable electronics are the focal point for many new concepts. The next generation of wearable products for the consumer electronics industry will create a new market with nothing but upside for manufacturers and suppliers.

View Story

EPTE Newsletter: Thinner and Lighter Printed Circuits

09-03-2018

Manufacturers from the electronics industry consistently compete to create higher density circuits. Cutting edge semiconductor manufacturers can generate less than 10 nanometer traces on silicon chips.

View Story

EPTE Newsletter: Flexible Metal Laminates Made With Chemical Processes

08-28-2018

DKN Research is fielding many inquiries about a semi-additive process for the fine-line generation on thin, flexible substrates, including transparent heat-resistant plastic films. Most inquiries are from chip-on-film (COF) manufacturers with reel-to-reel (RTR) processes.

View Story

EPTE Newsletter: Flood Catastrophe in Japan

07-18-2018

The rainy season in Japan usually ends in early July; however, severe and abnormal weather plagued Japan during the entire month this year. First, a strong typhoon passing from south to north soaked the western island, Kyushu. The typhoon kicked off the seasonal rain front in the western half of Japan, which resulted in historical rainfall. Some areas received more than 1,000 millimeters of rain in less than four days—a record amount of rainfall for many towns.

View Story

EPTE Newsletter: Metallization for Plastic Surfaces

07-13-2018

During the 1980s, manufacturers ran around the barn a few times trying to decide the best way to produce reliable bond strength between polyimide sheets and copper foils when producing thin copper laminates for high-density flexible circuits.

View Story

EPTE Newsletter: JPCA SHOW 2018

06-15-2018

One of the largest exhibitions for the printed circuit industry was held June 6–8 at Tokyo Big Sight in Japan. The three-day show is held in Tokyo every June and attracts a worldwide audience. This year, related events at the show included JIEP 2018, JISSO PROTEC 2018, Total Organic Expo 2018, WIRE Japan Show 2018 and Smart Sensing 2018.

View Story
Back

2009

EPTE Newsletter: Sputtering or Chemical Plating?

12-24-2018

More than 20 years ago, material manufacturers competed with each other to develop adhesiveless copper-clad laminates for the next generation of flexible circuits. A dozen or so companies were leaders in the pack with their new technologies. These technologies were categorized into two types: a casting and laminating process, and the metallization of polyimide films.

View Story

EPTE Newsletter: Exotic Materials for Flexible Circuits

11-29-2018

Wearable technology is common in the electronics industry and is expected to be a profitable category for the next generation of electronics. An Amazon search for wearable technology leads to 30,000 results. Flexible circuits are the most significant packaging materials for wearable devices including medical and healthcare devices.

View Story

EPTE Newsletter: Hiccup for Taiwanese Electronics Industry?

10-24-2018

Shipments for the PCB industry during the Q2 and the beginning of Q3 came in at double-digit growth, and revenue for August increased by more than 13% compared to the same month last year. Manufacturers throughout the mobile device supply chain predicted sales would increase even more during Q4.

View Story

EPTE Newsletter: Taiwan Electronics are Heating Up (Figuratively)

10-15-2018

Dominique Numakura considers electronics manufacturing in Taiwan to be the barometer for the global consumer electronics industry. Market trends can be predicted by analyzing shipping data from Taiwanese circuit board manufacturers. Annual volume increases every year, despite slow monthly cycles.

View Story

EPTE Newsletter: New Materials for Wearable Electronics

09-20-2018

Technology continues to evolve, and wearable electronics are the focal point for many new concepts. The next generation of wearable products for the consumer electronics industry will create a new market with nothing but upside for manufacturers and suppliers.

View Story

EPTE Newsletter: Thinner and Lighter Printed Circuits

09-03-2018

Manufacturers from the electronics industry consistently compete to create higher density circuits. Cutting edge semiconductor manufacturers can generate less than 10 nanometer traces on silicon chips.

View Story

EPTE Newsletter: Flexible Metal Laminates Made With Chemical Processes

08-28-2018

DKN Research is fielding many inquiries about a semi-additive process for the fine-line generation on thin, flexible substrates, including transparent heat-resistant plastic films. Most inquiries are from chip-on-film (COF) manufacturers with reel-to-reel (RTR) processes.

View Story

EPTE Newsletter: Flood Catastrophe in Japan

07-18-2018

The rainy season in Japan usually ends in early July; however, severe and abnormal weather plagued Japan during the entire month this year. First, a strong typhoon passing from south to north soaked the western island, Kyushu. The typhoon kicked off the seasonal rain front in the western half of Japan, which resulted in historical rainfall. Some areas received more than 1,000 millimeters of rain in less than four days—a record amount of rainfall for many towns.

View Story

EPTE Newsletter: Metallization for Plastic Surfaces

07-13-2018

During the 1980s, manufacturers ran around the barn a few times trying to decide the best way to produce reliable bond strength between polyimide sheets and copper foils when producing thin copper laminates for high-density flexible circuits.

View Story

EPTE Newsletter: JPCA SHOW 2018

06-15-2018

One of the largest exhibitions for the printed circuit industry was held June 6–8 at Tokyo Big Sight in Japan. The three-day show is held in Tokyo every June and attracts a worldwide audience. This year, related events at the show included JIEP 2018, JISSO PROTEC 2018, Total Organic Expo 2018, WIRE Japan Show 2018 and Smart Sensing 2018.

View Story
Back

2008

EPTE Newsletter from Japan: Nanotechnology-Another Trendy Phrase

10-10-2008

More than a thousand companies, universities and research organizations dedicate resources toward business applications or R&D activities for nanotechnologies.

View Story

EPTE Newsletter from Japan: June PWB Production in Japan

08-27-2008

The Japanese Ministry of Economy, Trade and Industry (METI) recently released June's production data from Japan's printed circuit industry. We now have a six month snapshot for 2008 and can review market trends for this period and forecast performance for the remainder of the year.

View Story

EPTE Newsletter from Japan: JPCA Show 2008, Part VI

07-25-2008

As with previous years, the majority of attendees at the JPCA show were Korean and Taiwanese; however, one difference with this year's melting pot was the increase in North American and Western European visitors.

View Story

EPTE Newsletter from Japan--JPCA Show 2008, Part V

07-21-2008

Numakura spoke with one manager from a machine manufacturer who explained that small- and mid- sized assemblers, as well as prototype EMS companies from Japan, the U.S. and Europe, do not focus on high speeds, but, rather, a flexibility to manage many different products from a small line.

View Story

EPTE Newsletter from Japan--JPCA Show, Part IV

07-14-2008

Materials are always a significant detail to consider in the printed circuit industry, and most of the major material suppliers reserved relatively large booths at the JPCA exhibition. The material manufacturers displayed their new items; unfortunately, I could not find very innovative or novel products during the show.

View Story

EPTE Newsletter from Japan--JPCA Show, Part III

07-04-2008

The benchmark isn't set for the high-density fine line circuit segment from the Japanese printed circuit industry. The front runners featured their fine line capabilities during the exhibition in a very competitive fashion.

View Story

EPTE Newsletter from Japan--JPCA Show, Part II

06-26-2008

Embedded components seems to be a very "fashionable" trend, started last year, and most of the major rigid board companies and flexible circuit manufacturers paraded their latest achievements from their technological departments at the show.

View Story

EPTE Newsletter from Japan--JPCA Show 2008, Part I

06-19-2008

This year's show grabbed honors as the largest exhibition ever for the printed circuit industry, and the JPCA Show is arguably the greatest exhibition in terms of size and technology level.

View Story

EPTE Newsletter from Japan--The iPhone Has Landed

06-12-2008

Last week, Soft Bank, one of three wireless phone carriers in Japan, announced the launch of the first iPhone entry into the Japanese cellular phone market. Apple granted Soft Bank an exclusive contract as the sole provider of iPhones in Japan.

View Story

EPTE Newsletter from Japan--First Quarter 2008 PWB Production in Japan

06-04-2008

The Japanese Ministry of Economy, Trading and Industry (METI) recently released PWB production data for March. Total revenue in March was 81.12 billion yen; a 2.5% increase from February, but 1.5% lower than January's numbers--we are hopeful that this is simply a seasonal adjustment.

View Story
Back

2007

EPTE Newsletter from Japan: Nanotechnology-Another Trendy Phrase

10-10-2008

More than a thousand companies, universities and research organizations dedicate resources toward business applications or R&D activities for nanotechnologies.

View Story

EPTE Newsletter from Japan: June PWB Production in Japan

08-27-2008

The Japanese Ministry of Economy, Trade and Industry (METI) recently released June's production data from Japan's printed circuit industry. We now have a six month snapshot for 2008 and can review market trends for this period and forecast performance for the remainder of the year.

View Story

EPTE Newsletter from Japan: JPCA Show 2008, Part VI

07-25-2008

As with previous years, the majority of attendees at the JPCA show were Korean and Taiwanese; however, one difference with this year's melting pot was the increase in North American and Western European visitors.

View Story

EPTE Newsletter from Japan--JPCA Show 2008, Part V

07-21-2008

Numakura spoke with one manager from a machine manufacturer who explained that small- and mid- sized assemblers, as well as prototype EMS companies from Japan, the U.S. and Europe, do not focus on high speeds, but, rather, a flexibility to manage many different products from a small line.

View Story

EPTE Newsletter from Japan--JPCA Show, Part IV

07-14-2008

Materials are always a significant detail to consider in the printed circuit industry, and most of the major material suppliers reserved relatively large booths at the JPCA exhibition. The material manufacturers displayed their new items; unfortunately, I could not find very innovative or novel products during the show.

View Story

EPTE Newsletter from Japan--JPCA Show, Part III

07-04-2008

The benchmark isn't set for the high-density fine line circuit segment from the Japanese printed circuit industry. The front runners featured their fine line capabilities during the exhibition in a very competitive fashion.

View Story

EPTE Newsletter from Japan--JPCA Show, Part II

06-26-2008

Embedded components seems to be a very "fashionable" trend, started last year, and most of the major rigid board companies and flexible circuit manufacturers paraded their latest achievements from their technological departments at the show.

View Story

EPTE Newsletter from Japan--JPCA Show 2008, Part I

06-19-2008

This year's show grabbed honors as the largest exhibition ever for the printed circuit industry, and the JPCA Show is arguably the greatest exhibition in terms of size and technology level.

View Story

EPTE Newsletter from Japan--The iPhone Has Landed

06-12-2008

Last week, Soft Bank, one of three wireless phone carriers in Japan, announced the launch of the first iPhone entry into the Japanese cellular phone market. Apple granted Soft Bank an exclusive contract as the sole provider of iPhones in Japan.

View Story

EPTE Newsletter from Japan--First Quarter 2008 PWB Production in Japan

06-04-2008

The Japanese Ministry of Economy, Trading and Industry (METI) recently released PWB production data for March. Total revenue in March was 81.12 billion yen; a 2.5% increase from February, but 1.5% lower than January's numbers--we are hopeful that this is simply a seasonal adjustment.

View Story
Back

2006

EPTE Newsletter from Japan: Nanotechnology-Another Trendy Phrase

10-10-2008

More than a thousand companies, universities and research organizations dedicate resources toward business applications or R&D activities for nanotechnologies.

View Story

EPTE Newsletter from Japan: June PWB Production in Japan

08-27-2008

The Japanese Ministry of Economy, Trade and Industry (METI) recently released June's production data from Japan's printed circuit industry. We now have a six month snapshot for 2008 and can review market trends for this period and forecast performance for the remainder of the year.

View Story

EPTE Newsletter from Japan: JPCA Show 2008, Part VI

07-25-2008

As with previous years, the majority of attendees at the JPCA show were Korean and Taiwanese; however, one difference with this year's melting pot was the increase in North American and Western European visitors.

View Story

EPTE Newsletter from Japan--JPCA Show 2008, Part V

07-21-2008

Numakura spoke with one manager from a machine manufacturer who explained that small- and mid- sized assemblers, as well as prototype EMS companies from Japan, the U.S. and Europe, do not focus on high speeds, but, rather, a flexibility to manage many different products from a small line.

View Story

EPTE Newsletter from Japan--JPCA Show, Part IV

07-14-2008

Materials are always a significant detail to consider in the printed circuit industry, and most of the major material suppliers reserved relatively large booths at the JPCA exhibition. The material manufacturers displayed their new items; unfortunately, I could not find very innovative or novel products during the show.

View Story

EPTE Newsletter from Japan--JPCA Show, Part III

07-04-2008

The benchmark isn't set for the high-density fine line circuit segment from the Japanese printed circuit industry. The front runners featured their fine line capabilities during the exhibition in a very competitive fashion.

View Story

EPTE Newsletter from Japan--JPCA Show, Part II

06-26-2008

Embedded components seems to be a very "fashionable" trend, started last year, and most of the major rigid board companies and flexible circuit manufacturers paraded their latest achievements from their technological departments at the show.

View Story

EPTE Newsletter from Japan--JPCA Show 2008, Part I

06-19-2008

This year's show grabbed honors as the largest exhibition ever for the printed circuit industry, and the JPCA Show is arguably the greatest exhibition in terms of size and technology level.

View Story

EPTE Newsletter from Japan--The iPhone Has Landed

06-12-2008

Last week, Soft Bank, one of three wireless phone carriers in Japan, announced the launch of the first iPhone entry into the Japanese cellular phone market. Apple granted Soft Bank an exclusive contract as the sole provider of iPhones in Japan.

View Story

EPTE Newsletter from Japan--First Quarter 2008 PWB Production in Japan

06-04-2008

The Japanese Ministry of Economy, Trading and Industry (METI) recently released PWB production data for March. Total revenue in March was 81.12 billion yen; a 2.5% increase from February, but 1.5% lower than January's numbers--we are hopeful that this is simply a seasonal adjustment.

View Story
Back

2005

EPTE Newsletter from Japan: Nanotechnology-Another Trendy Phrase

10-10-2008

More than a thousand companies, universities and research organizations dedicate resources toward business applications or R&D activities for nanotechnologies.

View Story

EPTE Newsletter from Japan: June PWB Production in Japan

08-27-2008

The Japanese Ministry of Economy, Trade and Industry (METI) recently released June's production data from Japan's printed circuit industry. We now have a six month snapshot for 2008 and can review market trends for this period and forecast performance for the remainder of the year.

View Story

EPTE Newsletter from Japan: JPCA Show 2008, Part VI

07-25-2008

As with previous years, the majority of attendees at the JPCA show were Korean and Taiwanese; however, one difference with this year's melting pot was the increase in North American and Western European visitors.

View Story

EPTE Newsletter from Japan--JPCA Show 2008, Part V

07-21-2008

Numakura spoke with one manager from a machine manufacturer who explained that small- and mid- sized assemblers, as well as prototype EMS companies from Japan, the U.S. and Europe, do not focus on high speeds, but, rather, a flexibility to manage many different products from a small line.

View Story

EPTE Newsletter from Japan--JPCA Show, Part IV

07-14-2008

Materials are always a significant detail to consider in the printed circuit industry, and most of the major material suppliers reserved relatively large booths at the JPCA exhibition. The material manufacturers displayed their new items; unfortunately, I could not find very innovative or novel products during the show.

View Story

EPTE Newsletter from Japan--JPCA Show, Part III

07-04-2008

The benchmark isn't set for the high-density fine line circuit segment from the Japanese printed circuit industry. The front runners featured their fine line capabilities during the exhibition in a very competitive fashion.

View Story

EPTE Newsletter from Japan--JPCA Show, Part II

06-26-2008

Embedded components seems to be a very "fashionable" trend, started last year, and most of the major rigid board companies and flexible circuit manufacturers paraded their latest achievements from their technological departments at the show.

View Story

EPTE Newsletter from Japan--JPCA Show 2008, Part I

06-19-2008

This year's show grabbed honors as the largest exhibition ever for the printed circuit industry, and the JPCA Show is arguably the greatest exhibition in terms of size and technology level.

View Story

EPTE Newsletter from Japan--The iPhone Has Landed

06-12-2008

Last week, Soft Bank, one of three wireless phone carriers in Japan, announced the launch of the first iPhone entry into the Japanese cellular phone market. Apple granted Soft Bank an exclusive contract as the sole provider of iPhones in Japan.

View Story

EPTE Newsletter from Japan--First Quarter 2008 PWB Production in Japan

06-04-2008

The Japanese Ministry of Economy, Trading and Industry (METI) recently released PWB production data for March. Total revenue in March was 81.12 billion yen; a 2.5% increase from February, but 1.5% lower than January's numbers--we are hopeful that this is simply a seasonal adjustment.

View Story
Back

2004

EPTE Newsletter from Japan: Nanotechnology-Another Trendy Phrase

10-10-2008

More than a thousand companies, universities and research organizations dedicate resources toward business applications or R&D activities for nanotechnologies.

View Story

EPTE Newsletter from Japan: June PWB Production in Japan

08-27-2008

The Japanese Ministry of Economy, Trade and Industry (METI) recently released June's production data from Japan's printed circuit industry. We now have a six month snapshot for 2008 and can review market trends for this period and forecast performance for the remainder of the year.

View Story

EPTE Newsletter from Japan: JPCA Show 2008, Part VI

07-25-2008

As with previous years, the majority of attendees at the JPCA show were Korean and Taiwanese; however, one difference with this year's melting pot was the increase in North American and Western European visitors.

View Story

EPTE Newsletter from Japan--JPCA Show 2008, Part V

07-21-2008

Numakura spoke with one manager from a machine manufacturer who explained that small- and mid- sized assemblers, as well as prototype EMS companies from Japan, the U.S. and Europe, do not focus on high speeds, but, rather, a flexibility to manage many different products from a small line.

View Story

EPTE Newsletter from Japan--JPCA Show, Part IV

07-14-2008

Materials are always a significant detail to consider in the printed circuit industry, and most of the major material suppliers reserved relatively large booths at the JPCA exhibition. The material manufacturers displayed their new items; unfortunately, I could not find very innovative or novel products during the show.

View Story

EPTE Newsletter from Japan--JPCA Show, Part III

07-04-2008

The benchmark isn't set for the high-density fine line circuit segment from the Japanese printed circuit industry. The front runners featured their fine line capabilities during the exhibition in a very competitive fashion.

View Story

EPTE Newsletter from Japan--JPCA Show, Part II

06-26-2008

Embedded components seems to be a very "fashionable" trend, started last year, and most of the major rigid board companies and flexible circuit manufacturers paraded their latest achievements from their technological departments at the show.

View Story

EPTE Newsletter from Japan--JPCA Show 2008, Part I

06-19-2008

This year's show grabbed honors as the largest exhibition ever for the printed circuit industry, and the JPCA Show is arguably the greatest exhibition in terms of size and technology level.

View Story

EPTE Newsletter from Japan--The iPhone Has Landed

06-12-2008

Last week, Soft Bank, one of three wireless phone carriers in Japan, announced the launch of the first iPhone entry into the Japanese cellular phone market. Apple granted Soft Bank an exclusive contract as the sole provider of iPhones in Japan.

View Story

EPTE Newsletter from Japan--First Quarter 2008 PWB Production in Japan

06-04-2008

The Japanese Ministry of Economy, Trading and Industry (METI) recently released PWB production data for March. Total revenue in March was 81.12 billion yen; a 2.5% increase from February, but 1.5% lower than January's numbers--we are hopeful that this is simply a seasonal adjustment.

View Story
Back

2003

EPTE Newsletter from Japan: Nanotechnology-Another Trendy Phrase

10-10-2008

More than a thousand companies, universities and research organizations dedicate resources toward business applications or R&D activities for nanotechnologies.

View Story

EPTE Newsletter from Japan: June PWB Production in Japan

08-27-2008

The Japanese Ministry of Economy, Trade and Industry (METI) recently released June's production data from Japan's printed circuit industry. We now have a six month snapshot for 2008 and can review market trends for this period and forecast performance for the remainder of the year.

View Story

EPTE Newsletter from Japan: JPCA Show 2008, Part VI

07-25-2008

As with previous years, the majority of attendees at the JPCA show were Korean and Taiwanese; however, one difference with this year's melting pot was the increase in North American and Western European visitors.

View Story

EPTE Newsletter from Japan--JPCA Show 2008, Part V

07-21-2008

Numakura spoke with one manager from a machine manufacturer who explained that small- and mid- sized assemblers, as well as prototype EMS companies from Japan, the U.S. and Europe, do not focus on high speeds, but, rather, a flexibility to manage many different products from a small line.

View Story

EPTE Newsletter from Japan--JPCA Show, Part IV

07-14-2008

Materials are always a significant detail to consider in the printed circuit industry, and most of the major material suppliers reserved relatively large booths at the JPCA exhibition. The material manufacturers displayed their new items; unfortunately, I could not find very innovative or novel products during the show.

View Story

EPTE Newsletter from Japan--JPCA Show, Part III

07-04-2008

The benchmark isn't set for the high-density fine line circuit segment from the Japanese printed circuit industry. The front runners featured their fine line capabilities during the exhibition in a very competitive fashion.

View Story

EPTE Newsletter from Japan--JPCA Show, Part II

06-26-2008

Embedded components seems to be a very "fashionable" trend, started last year, and most of the major rigid board companies and flexible circuit manufacturers paraded their latest achievements from their technological departments at the show.

View Story

EPTE Newsletter from Japan--JPCA Show 2008, Part I

06-19-2008

This year's show grabbed honors as the largest exhibition ever for the printed circuit industry, and the JPCA Show is arguably the greatest exhibition in terms of size and technology level.

View Story

EPTE Newsletter from Japan--The iPhone Has Landed

06-12-2008

Last week, Soft Bank, one of three wireless phone carriers in Japan, announced the launch of the first iPhone entry into the Japanese cellular phone market. Apple granted Soft Bank an exclusive contract as the sole provider of iPhones in Japan.

View Story

EPTE Newsletter from Japan--First Quarter 2008 PWB Production in Japan

06-04-2008

The Japanese Ministry of Economy, Trading and Industry (METI) recently released PWB production data for March. Total revenue in March was 81.12 billion yen; a 2.5% increase from February, but 1.5% lower than January's numbers--we are hopeful that this is simply a seasonal adjustment.

View Story
Back

2002

EPTE Newsletter from Japan: Nanotechnology-Another Trendy Phrase

10-10-2008

More than a thousand companies, universities and research organizations dedicate resources toward business applications or R&D activities for nanotechnologies.

View Story

EPTE Newsletter from Japan: June PWB Production in Japan

08-27-2008

The Japanese Ministry of Economy, Trade and Industry (METI) recently released June's production data from Japan's printed circuit industry. We now have a six month snapshot for 2008 and can review market trends for this period and forecast performance for the remainder of the year.

View Story

EPTE Newsletter from Japan: JPCA Show 2008, Part VI

07-25-2008

As with previous years, the majority of attendees at the JPCA show were Korean and Taiwanese; however, one difference with this year's melting pot was the increase in North American and Western European visitors.

View Story

EPTE Newsletter from Japan--JPCA Show 2008, Part V

07-21-2008

Numakura spoke with one manager from a machine manufacturer who explained that small- and mid- sized assemblers, as well as prototype EMS companies from Japan, the U.S. and Europe, do not focus on high speeds, but, rather, a flexibility to manage many different products from a small line.

View Story

EPTE Newsletter from Japan--JPCA Show, Part IV

07-14-2008

Materials are always a significant detail to consider in the printed circuit industry, and most of the major material suppliers reserved relatively large booths at the JPCA exhibition. The material manufacturers displayed their new items; unfortunately, I could not find very innovative or novel products during the show.

View Story

EPTE Newsletter from Japan--JPCA Show, Part III

07-04-2008

The benchmark isn't set for the high-density fine line circuit segment from the Japanese printed circuit industry. The front runners featured their fine line capabilities during the exhibition in a very competitive fashion.

View Story

EPTE Newsletter from Japan--JPCA Show, Part II

06-26-2008

Embedded components seems to be a very "fashionable" trend, started last year, and most of the major rigid board companies and flexible circuit manufacturers paraded their latest achievements from their technological departments at the show.

View Story

EPTE Newsletter from Japan--JPCA Show 2008, Part I

06-19-2008

This year's show grabbed honors as the largest exhibition ever for the printed circuit industry, and the JPCA Show is arguably the greatest exhibition in terms of size and technology level.

View Story

EPTE Newsletter from Japan--The iPhone Has Landed

06-12-2008

Last week, Soft Bank, one of three wireless phone carriers in Japan, announced the launch of the first iPhone entry into the Japanese cellular phone market. Apple granted Soft Bank an exclusive contract as the sole provider of iPhones in Japan.

View Story

EPTE Newsletter from Japan--First Quarter 2008 PWB Production in Japan

06-04-2008

The Japanese Ministry of Economy, Trading and Industry (METI) recently released PWB production data for March. Total revenue in March was 81.12 billion yen; a 2.5% increase from February, but 1.5% lower than January's numbers--we are hopeful that this is simply a seasonal adjustment.

View Story
Back

2001

EPTE Newsletter from Japan: Nanotechnology-Another Trendy Phrase

10-10-2008

More than a thousand companies, universities and research organizations dedicate resources toward business applications or R&D activities for nanotechnologies.

View Story

EPTE Newsletter from Japan: June PWB Production in Japan

08-27-2008

The Japanese Ministry of Economy, Trade and Industry (METI) recently released June's production data from Japan's printed circuit industry. We now have a six month snapshot for 2008 and can review market trends for this period and forecast performance for the remainder of the year.

View Story

EPTE Newsletter from Japan: JPCA Show 2008, Part VI

07-25-2008

As with previous years, the majority of attendees at the JPCA show were Korean and Taiwanese; however, one difference with this year's melting pot was the increase in North American and Western European visitors.

View Story

EPTE Newsletter from Japan--JPCA Show 2008, Part V

07-21-2008

Numakura spoke with one manager from a machine manufacturer who explained that small- and mid- sized assemblers, as well as prototype EMS companies from Japan, the U.S. and Europe, do not focus on high speeds, but, rather, a flexibility to manage many different products from a small line.

View Story

EPTE Newsletter from Japan--JPCA Show, Part IV

07-14-2008

Materials are always a significant detail to consider in the printed circuit industry, and most of the major material suppliers reserved relatively large booths at the JPCA exhibition. The material manufacturers displayed their new items; unfortunately, I could not find very innovative or novel products during the show.

View Story

EPTE Newsletter from Japan--JPCA Show, Part III

07-04-2008

The benchmark isn't set for the high-density fine line circuit segment from the Japanese printed circuit industry. The front runners featured their fine line capabilities during the exhibition in a very competitive fashion.

View Story

EPTE Newsletter from Japan--JPCA Show, Part II

06-26-2008

Embedded components seems to be a very "fashionable" trend, started last year, and most of the major rigid board companies and flexible circuit manufacturers paraded their latest achievements from their technological departments at the show.

View Story

EPTE Newsletter from Japan--JPCA Show 2008, Part I

06-19-2008

This year's show grabbed honors as the largest exhibition ever for the printed circuit industry, and the JPCA Show is arguably the greatest exhibition in terms of size and technology level.

View Story

EPTE Newsletter from Japan--The iPhone Has Landed

06-12-2008

Last week, Soft Bank, one of three wireless phone carriers in Japan, announced the launch of the first iPhone entry into the Japanese cellular phone market. Apple granted Soft Bank an exclusive contract as the sole provider of iPhones in Japan.

View Story

EPTE Newsletter from Japan--First Quarter 2008 PWB Production in Japan

06-04-2008

The Japanese Ministry of Economy, Trading and Industry (METI) recently released PWB production data for March. Total revenue in March was 81.12 billion yen; a 2.5% increase from February, but 1.5% lower than January's numbers--we are hopeful that this is simply a seasonal adjustment.

View Story
Back

2000

EPTE Newsletter from Japan: Nanotechnology-Another Trendy Phrase

10-10-2008

More than a thousand companies, universities and research organizations dedicate resources toward business applications or R&D activities for nanotechnologies.

View Story

EPTE Newsletter from Japan: June PWB Production in Japan

08-27-2008

The Japanese Ministry of Economy, Trade and Industry (METI) recently released June's production data from Japan's printed circuit industry. We now have a six month snapshot for 2008 and can review market trends for this period and forecast performance for the remainder of the year.

View Story

EPTE Newsletter from Japan: JPCA Show 2008, Part VI

07-25-2008

As with previous years, the majority of attendees at the JPCA show were Korean and Taiwanese; however, one difference with this year's melting pot was the increase in North American and Western European visitors.

View Story

EPTE Newsletter from Japan--JPCA Show 2008, Part V

07-21-2008

Numakura spoke with one manager from a machine manufacturer who explained that small- and mid- sized assemblers, as well as prototype EMS companies from Japan, the U.S. and Europe, do not focus on high speeds, but, rather, a flexibility to manage many different products from a small line.

View Story

EPTE Newsletter from Japan--JPCA Show, Part IV

07-14-2008

Materials are always a significant detail to consider in the printed circuit industry, and most of the major material suppliers reserved relatively large booths at the JPCA exhibition. The material manufacturers displayed their new items; unfortunately, I could not find very innovative or novel products during the show.

View Story

EPTE Newsletter from Japan--JPCA Show, Part III

07-04-2008

The benchmark isn't set for the high-density fine line circuit segment from the Japanese printed circuit industry. The front runners featured their fine line capabilities during the exhibition in a very competitive fashion.

View Story

EPTE Newsletter from Japan--JPCA Show, Part II

06-26-2008

Embedded components seems to be a very "fashionable" trend, started last year, and most of the major rigid board companies and flexible circuit manufacturers paraded their latest achievements from their technological departments at the show.

View Story

EPTE Newsletter from Japan--JPCA Show 2008, Part I

06-19-2008

This year's show grabbed honors as the largest exhibition ever for the printed circuit industry, and the JPCA Show is arguably the greatest exhibition in terms of size and technology level.

View Story

EPTE Newsletter from Japan--The iPhone Has Landed

06-12-2008

Last week, Soft Bank, one of three wireless phone carriers in Japan, announced the launch of the first iPhone entry into the Japanese cellular phone market. Apple granted Soft Bank an exclusive contract as the sole provider of iPhones in Japan.

View Story

EPTE Newsletter from Japan--First Quarter 2008 PWB Production in Japan

06-04-2008

The Japanese Ministry of Economy, Trading and Industry (METI) recently released PWB production data for March. Total revenue in March was 81.12 billion yen; a 2.5% increase from February, but 1.5% lower than January's numbers--we are hopeful that this is simply a seasonal adjustment.

View Story
Back

1999

EPTE Newsletter from Japan: Nanotechnology-Another Trendy Phrase

10-10-2008

More than a thousand companies, universities and research organizations dedicate resources toward business applications or R&D activities for nanotechnologies.

View Story

EPTE Newsletter from Japan: June PWB Production in Japan

08-27-2008

The Japanese Ministry of Economy, Trade and Industry (METI) recently released June's production data from Japan's printed circuit industry. We now have a six month snapshot for 2008 and can review market trends for this period and forecast performance for the remainder of the year.

View Story

EPTE Newsletter from Japan: JPCA Show 2008, Part VI

07-25-2008

As with previous years, the majority of attendees at the JPCA show were Korean and Taiwanese; however, one difference with this year's melting pot was the increase in North American and Western European visitors.

View Story

EPTE Newsletter from Japan--JPCA Show 2008, Part V

07-21-2008

Numakura spoke with one manager from a machine manufacturer who explained that small- and mid- sized assemblers, as well as prototype EMS companies from Japan, the U.S. and Europe, do not focus on high speeds, but, rather, a flexibility to manage many different products from a small line.

View Story

EPTE Newsletter from Japan--JPCA Show, Part IV

07-14-2008

Materials are always a significant detail to consider in the printed circuit industry, and most of the major material suppliers reserved relatively large booths at the JPCA exhibition. The material manufacturers displayed their new items; unfortunately, I could not find very innovative or novel products during the show.

View Story

EPTE Newsletter from Japan--JPCA Show, Part III

07-04-2008

The benchmark isn't set for the high-density fine line circuit segment from the Japanese printed circuit industry. The front runners featured their fine line capabilities during the exhibition in a very competitive fashion.

View Story

EPTE Newsletter from Japan--JPCA Show, Part II

06-26-2008

Embedded components seems to be a very "fashionable" trend, started last year, and most of the major rigid board companies and flexible circuit manufacturers paraded their latest achievements from their technological departments at the show.

View Story

EPTE Newsletter from Japan--JPCA Show 2008, Part I

06-19-2008

This year's show grabbed honors as the largest exhibition ever for the printed circuit industry, and the JPCA Show is arguably the greatest exhibition in terms of size and technology level.

View Story

EPTE Newsletter from Japan--The iPhone Has Landed

06-12-2008

Last week, Soft Bank, one of three wireless phone carriers in Japan, announced the launch of the first iPhone entry into the Japanese cellular phone market. Apple granted Soft Bank an exclusive contract as the sole provider of iPhones in Japan.

View Story

EPTE Newsletter from Japan--First Quarter 2008 PWB Production in Japan

06-04-2008

The Japanese Ministry of Economy, Trading and Industry (METI) recently released PWB production data for March. Total revenue in March was 81.12 billion yen; a 2.5% increase from February, but 1.5% lower than January's numbers--we are hopeful that this is simply a seasonal adjustment.

View Story
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