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Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design

04/25/2024 | Cadence Design Systems
Cadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.

SMC Korea 2024 to Highlight Semiconductor Materials Trends and Innovations on Industry’s Path to $1 Trillion

04/24/2024 | SEMI
With Korea a major consumer of semiconductor materials and advanced materials a key driver of innovation on the industry’s path to $1 trillion, industry leaders and experts will gather at SMC (Strategic Materials Conference) Korea 2024 on May 29 at the Suwon Convention Center in Gyeonggi-do, South Korea to provide insights into the latest materials developments and trends. Registration is open.

Orbex Secures £16.7m Investment for Rocket ‘Ramp Up’ Period

04/24/2024 | Orbex
The UK spaceflight company Orbex has received £16.7m from six backers in an update to its Series C funding round.

Real Time with... IPC APEX EXPO 2024: Going Vertical: SCHMID's Advanced Solutions for Printed Circuit Boards

04/24/2024 | Real Time with...IPC APEX EXPO
Editor Marcy LaRont chats with Bob Ferguson, the president of SCHMID, about advanced solutions for PCBs and the equipment they are highlighting at this year's show. He delves into vertical no-touch handling systems and the prospect of achieving sub-10-micron lines. Inspired by SCHMID's technology, Bob expresses excitement about where the industry is today.

Real Time with... IPC APEX EXPO 2024: Advancements in Laser Depaneling with LPKF

04/24/2024 | Real Time with...IPC APEX EXPO
Jake Benz, LPKF sales manager for North America, discusses the company's advancements in laser depaneling. LPKF has introduced a green wavelength laser for processing rigid FR-4 circuit boards, bringing significant gains in processing speeds to market. The company transitioned from IR CO2 to UV wavelength due to heat and burning issues.
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