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The European Institute of Printed Circuits (EIPC) is inviting the industry to submit a paper for presentation at the upcoming EIPC Summer Conference 2015 in June.
Papers are being sought on the following subjects: status of the PCB industry today; EMS/ODM market & technology trends for Europe; Technology demands for PCBs in renewable energy applications; future interconnect and electronic component developments; technology roadmaps for various industry sectors; PCBs with embedded devices; molded interconnect devices (MIDs); and reliability of PCBs and assemblies, measurement and testing methods, to name a few.
For more information, click here.
For details on how and when to submit, click here.
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Patty Goldman, I-Connect007
Industry consultant Walt Custer of Custer Consulting sat down with me at productronica 2017 to once again inform our readers with his yearly update and perspective on what’s happening in the industry. And guess what? It’s good news! Pertinent charts referenced in our conversation are included, but if you want more, Walt invites you to click the link at the end of this conversation and email him directly.
From the show floor at productronica 2017, Electra Polymers' sales manager Ashley Steers discusses the state of the art in soldermask for direct imaging. Sales and marketing director Shaun Tibbals comments on developments in ink-jet soldermask, and opportunities in wafer-level packaging.
From the show floor at productronica 2017, we stopped by the DIS booth for a conversation with Tony Faraci. Here, he explains how DIS has tackled the challenges of handling and alignment of flex-rigid multilayer builds (especially cut-out pre-preg layers and packing pieces) and automated what was previously an operator-dependent manual process.