EIPC Seeks Papers for 2015 Summer Conference


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The European Institute of Printed Circuits (EIPC) is inviting the industry to submit a paper for presentation at the upcoming EIPC Summer Conference 2015 in June.

Papers are being sought on the following subjects: status of the PCB industry today; EMS/ODM market & technology trends for Europe; Technology demands for PCBs in renewable energy applications; future interconnect and electronic component developments; technology roadmaps for various industry sectors; PCBs with embedded devices; molded interconnect devices (MIDs); and reliability of PCBs and assemblies, measurement and testing methods, to name a few.

For more information, click here.

For details on how and when to submit, click here.

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