PCB Technologies' Subsidiary iNPACK to Exhibit at IMS Show



Jeff De Serrano, president of PCB Technologies USA, discusses the launch of their new company, iNPACK, which focuses on high-tech substrate technologies, microelectronics assembly, and electronics packaging. He details his plans to continue expanding iNPACK over the next year and to meet with customers and exhibit at the International Microwave Symposium Show in Denver June 19-24. 

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