Newly Appointed IPC APEX EXPO Technical Program Committee Calls for IPC APEX EXPO 2022 Participation

Reading time ( words)

The newly appointed IPC APEX EXPO Technical Program Committee (TPC) is inviting engineers, researchers, academics, technical experts, and industry leaders to submit technical conference abstracts for IPC APEX EXPO 2022 to be held at the San Diego Convention Center. The technical conference will take place January 25–27, 2022.

“The TPC – comprised of top technical leadership and subject matter experts from across the electronics industry – continues to build and strengthen the IPC APEX EXPO technical conference. A new committee chair and co-chair, expanded committee size, and a new structure enables the group to be future focused and provide a stronger technical voice spanning various technologies and the supply chain,” said Matt Kelly, IPC chief technologist. “The TPC’s mission is to deliver strong, relevant, and valuable technical programming that balances conventional technology advances with next-generation disruptive technologies. With these upgrades to the TPC, I’m excited to see what the IPC APEX EXPO 2022 technical conference has in store.”

Led by Beverley Christian, Ph.D., HDP User Group (Chair) and Stanton Rak, Ph.D., SF Rak Co. (Co-Chair) the 24-person committee comprises the following members: Bhanu Sood, Ph.D., NASA Goddard Space Flight Center; Cheryl Tulkoff, NI; Chris Jorgensen, IPC; Hans-Peter Tranitz, Ph.D., Continental Automotive GmbH; Jason Keeping, Celestica Inc.; Jerry Magera, Motorola Solutions; Martin Goetz, Northrop Grumman Corporation; Matt Kelly, IPC; Michael Ford, Aegis Industrial Software; Michael Carano, RBP Chemical Technology, Inc.; Milos Lazic, Indium Corporation; Paige Fiet, Michigan Technological University; Paul Cooke, Asahi Glass Co. Ltd.; Radu Diaconescu, Swissmic SA; Raymond Whittier Jr., BAE Systems; Robert Kinyanjui, Ph.D., John Deere Electronic Solutions; Sarah Czaplewski, IBM; Steven Bowles, Lockheed Martin Corporation; Tim Burke, Ph.D., Arch Systems Inc.; Todd MacFadden, Bose Corporation; Toya Richardson, IPC; and Udo Welzel, Robert Bosch GmbH.

Technical conference paper abstracts are due June 18, 2021. An approximate 300-word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments and case studies, emphasize new techniques, discuss trends of interest and contain appropriate technical test results. To submit an abstract, visit


Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

08/12/2022 | Andy Shaughnessy, I-Connect007
There was some good news this week, as Republicans and Democrats managed to cooperate long enough to pass the CHIPS Act. Members of the House and Senate don’t usually act until they get worried about being voted out of office, so pardon me if I’m not ready to sing “Happy Days Are Here Again” just yet. But this is still really good news; the politicians are on the record now, and we can hold them accountable.

IPC's I-Connect007 Acquisition Update With John Mitchell

08/05/2022 | Nolan Johnson, I-Connect007
Editor Nolan Johnson speaks with I-Connect007 Publisher Barry Matties and IPC President and CEO John Mitchell about IPC's acquisition of the publishing company, and what this means to I-Connect007's readers.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

08/05/2022 | Nolan Johnson, I-Connect007
The Top 5 list this week contains industry analysis from IPC’s Shawn DuBravac, news on the passage of the U.S. “CHIPS Plus” bill, new materials from Ventec, news about a fab for sale, and a chemistry company completing their acquisition, plus a brand new book in the I-Connect007 eBooks series.

Copyright © 2022 I-Connect007. All rights reserved.