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APCT Inc has added Rigid Flex Optical Registration™ (RFS), developed by DIS Inc of Islandia, N.Y. to enhance their PCB registration capabilities. The RFS machine is built specifically to process difficult flex, rigid and rigid-flex jobs. Using DIS, Inc proprietary Optical Registration™ technology in conjunction with SmartWeld, the RFS has the ability to align inner-layers and pre-preg without the use of expensive pin-tooling.
Optical Registration™ allows for optical alignment of inner layers during the lay-up process of multi-layers and sequential build-up technology, eliminating the need to manually punch and pin individual layers prior to lamination. The tolerance build-up and variability associated with traditional pin lamination systems is eliminated.
A vision and positioning system sequentially align and clamp layers together utilizing a full platen, assuring coplanarity and accuracy. The aligned multi-layers are welded together with SmartWeld™, the patented coupled induction welding system developed by DIS Inc.
In addition, Optical Registration™ provides an opportunity to utilize X-ray inspection to quantify registration of welded multi-layers prior to lamination. The panel can then be measured after lamination, providing the data to analyze the lamination process and take corrective actions if necessary.
The process has been in use worldwide at both high tech and high-volume shops over the past several years. Some of the leading-edge requirements placed on PCB shops utilizing pin technologies are not able to be met unless they introduce Optical Registration.
About APCT Inc.
APCT is a leading manufacturer of high reliability rigid printed circuit boards. Located in Anaheim California, the plant is designed to facilitate world class cycle times and support a broad range of technologies. Their corporate culture focuses on continuous improvement and strives for “best in class” in service and support. APCT is ISO9001:2008, IPC 6012 Class III certified and ITAR registered.
About DIS Inc.
DIS Inc. is a worldwide leader in optical registration systems for the printed circuit board industry and an innovative producer of inner-layer/sub-lam registration and welding equipment. DIS has developed Direct Optical Registration™, a new method of optically registering and welding inner-layers/sub-lam such that registration is improved by eliminating mechanical tooling, operational cycle times are reduced and process flexibility is increased all while significantly reducing operating costs.