I-Connect007 Editor's Choice: Five Must-Reads for the Week

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This week, we’ve covered a variety of bases in our newsletters and websites. In my top five picks, we have news about columnist Tara Dunn moving to Averatek to work with their A-SAP additive processes, and an interview with Audrey Sim regarding the “hybrid” model adopted by the HKPCA for its upcoming Electronic Circuits World Convention.

We also have a compilation of the questions that readers have asked Joe Fjelstad and news about DownStream Technologies adding support for flex, rigid-flex, and embedded component designs. Finally, we share a review of some of KYZEN’s new training sessions on cleaning electronic assemblies—virtual courses that pack a lot of information into 15-minute snapshots. Knowing how tight everyone’s schedules are now, 15-minute events might be the ticket.

Just Ask Joe Fjelstad: The Exclusive Compilation
Published November 19

Our “Just Ask” series continues to be popular with readers from across the electronics development spectrum, and columnist Joe Fjelstad was happy to answer your queries about topics new and old. There’s a thirst for knowledge in our industry, and we’ll keep bringing you the experts who have the information you need.

HKPCA’s Audrey Sim Details Upcoming Electronic Circuits World Convention
Published November 18

After covering a variety of virtual trade shows this fall, I can’t say I’m shocked to see the Hong Kong Printed Circuit Association holding their 2020 Electronic Circuits World Convention as both a virtual and physical show. In this interview, Audrey Sim of HKPCA details this hybrid event, which will be virtual for all three days, while the last day’s forum will also be a live event. This might be a great model for trade shows as we move forward. The show takes place from November 30 through December 2.

New DownStream Software Supports Flex, Rigid-Flex, and Embedded Component Designs
Published November 17

Flex and rigid-flex keep marching on, making inroads into many of our military, aerospace, and household devices. Now, DownStream Technologies has added support for flex, rigid-flex, and embedded component designs to their CAM350, DFMStream, and BluePrint-PCB flows. DownStream will now support importation and visualization of flex, rigid-flex, and embedded designs in 2D and 3D.

High-Tech, High-Value Cleaning Answers Made Easy With KYZEN’s Tech-2-Tech
Published November 19

This summer, KYZEN introduced its Tech-2-Tech training initiative, a series of 15-minute virtual sessions focused on cleaning electronic assemblies. In this review, Technical Editor Pete Starkey discusses his takeaways from a number of these training sessions, including “the five forces of cleaning” and how surprised he was to learn so much in a quarter of an hour. One upcoming holiday session will cover “Smart pH Employment in Electronic Cleaning: What Is the pH of Eggnog?” 

Tara Dunn Transitions to New Role at Averatek
Published November 19

Tara Dunn recently joined Averatek, the company that created the A-SAP high-density additive manufacturing process. In this interview with Editors Michelle Te and Nolan Johnson, Tara discusses her new role as vice president of marketing and development at Averatek and why she believes that the additive process represents the future of high-density PCB manufacturing.

03/21/2023 | Dan Beaulieu, D.B. Management Group

I have always felt that automation has the potential to make a big difference in our PCB industry, especially domestically, where labor is at premium. For the past year, I have been looking for the story of how automation can and will make a significant difference in established PCB shops. I was fortunate enough to find that story in Multicircuits, located in Oshkosh, Wisconsin. Only a few short years ago, this company was considered a “plain vanilla” PCB fabricator holding its own in our industry; now it has suddenly assumed a true leadership position in the industry in terms of capability, technology, operations, and profitability.

03/07/2023 | Patty Goldman, I-Connect007

Dieter Bergman IPC Fellowship Award winner Curtis Grosskopf, a senior engineer at IBM, reflects on the evolution of IPC committees and the vital importance of their work, especially in collaboratively creating industry-wide standards to guide the work of professionals in every sector. This commitment to multidisciplinary cooperation is a mindset that should be fostered at the start of every career.

03/02/2023 | Nolan Johnson, I-Connect007

In his State of the Union address in early February, President Biden departed from his usual topics about education and the economy to mention the new CHIPS Act, as well as supply chain and infrastructure issues. For perspective on those remarks, Nolan Johnson chats with David Schild, executive director of the Printed Circuit Board Association of America (PCBAA).