Insulectro Appoints Industry Veteran John Odom to Advisory Board


Reading time ( words)

Insulectro, the largest distributor of materials for use in the printed circuit board and printed electronics industries, has announced the appointment of industry veteran John Odom to its advisory board.

Odom retired from DuPont in 2019 where he had held global leadership roles in printed circuit materials, semiconductor materials, and photovoltaic materials businesses. He had also served on the boards of DA NanoMaterials and HD MicroSystems, leading suppliers of proprietary materials to the semiconductor industry. While at DuPont, Odom also led numerous M&A initiatives and had extensive electronic materials business experience in Asia. During his career Odom has been active in IPC and SEMI, where he chaired the Chemicals and Gases Manufacturers Group and the Strategic Materials Conference.

Odom is a graduate of Clemson University in Chemical Engineering and he received Executive Education at The Wharton School of the University of Pennsylvania.

“John is highly regarded in the electronic materials industry for his market and business expertise, strong customer focus, and personal values,” remarked Insulectro President and CEO, Patrick Redfern. “Insulectro and DuPont have an extensive history and together our companies have led the industry. Through John’s experiences and skills, he brings critical insight and perspective to our Advisory Board, and we are excited to welcome him to the Insulectro team.

Share

Print


Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

07/10/2020 | Nolan Johnson, PCB007
The common theme in this week’s Top 5 editor’s picks is “change.” We’re talking change in the form of forwarding process, achieving milestones, evolving, and improving metrics. This week’s picks are not only newsworthy but also captured reader attention based on metrics. If you haven’t read any other news items from the industry this week, I propose these five must-reads.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

07/03/2020 | Andy Shaughnessy, Design007 Magazine
The USMCA trade agreement was just the tip of the iceberg in news affecting our industry this week. We also saw more young people getting involved in the industry, an HDP User Group webinar on automotive thermal issues, and more questions for our own Happy Holden—this time, on stacked microvia reliability, or the lack thereof.

Materials for Automotive Applications: Thermal Management Issues

07/02/2020 | Pete Starkey, I-Connect007
For Pete Starkey, the highlight of the recent HDP User Group Automotive Technology Webinar was Alun Morgan’s presentation on materials for automotive applications. This forward-looking informational session covered the latest developments in automotive standards and automotive electronic packaging.



Copyright © 2020 I-Connect007. All rights reserved.