DuPont Introduces New Pyralux and Riston Products


Reading time ( words)

DuPont Interconnect Solutions announced today that it is introducing several new products across its DuPont™ Pyralux® and Riston® product families to address a diverse set of needs for both the manufacture and performance of advanced electronics devices.  DuPont will showcase these new products and many other innovations at the upcoming IPC APEX tradeshow in San Diego, California, Feb. 4-6, booth #4118.

“DuPont Interconnect Solutions is focused on helping our customers push performance boundaries, while also meeting complicated processing demands,” said Andy Kannurpatti, West Business Leader, DuPont Interconnect Solutions. “With the introduction of these newest products, we are demonstrating again our resolve to create novel solutions that meet the needs of our customers today and in the future.”

DuPont’s newest product innovations include:

  • Pyralux® AG – an all-polyimide double sided copper clad laminate that is offered in both sheets and rolls with global availability and is ideal for use in high volume consumer, medical and automotive applications.
  • Pyralux® GPL – an adhesive that is specifically formulated for high-speed, high-frequency flexible circuit applications; it has outstanding thermal resistance, peel strength and UV laser drilling process capability.
  • Riston® DI3000  multi-wavelength, dry-film photoresist for pattern plating on multi-layer boards.  High adhesion and chemical resistance delivers yield by eliminating lifting and breakdown defects in copper, tin or gold.
  • Riston® DI5100  optimum solution for the mSAP process.  Made for smooth copper high adhesion on isolated resist lines, this film delivers the ultimate high density circuits made today.
  • Riston® DI9200 – high density interconnect film for print and etch process. High resolution and adhesion, combined with excellent lamination conformation, ensures high yields.  Fast photospeed at multiple LDI wavelengths ensures high productivity.

DuPont Interconnect Solutions brings a deep understanding of materials science to the printed circuit board (PCB) market. We provide materials that support all aspects of PCB manufacturing for many types of PCBs: single- or double-sided boards and flexible, rigid-flex, or rigid configurations.

As a market leader in flexible PCB laminates, dry film photoresists and high-reliability metallization, we allow our customers to push the design envelope and create products that perform faster and more reliably.

Share

Print


Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

07/10/2020 | Nolan Johnson, PCB007
The common theme in this week’s Top 5 editor’s picks is “change.” We’re talking change in the form of forwarding process, achieving milestones, evolving, and improving metrics. This week’s picks are not only newsworthy but also captured reader attention based on metrics. If you haven’t read any other news items from the industry this week, I propose these five must-reads.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

07/03/2020 | Andy Shaughnessy, Design007 Magazine
The USMCA trade agreement was just the tip of the iceberg in news affecting our industry this week. We also saw more young people getting involved in the industry, an HDP User Group webinar on automotive thermal issues, and more questions for our own Happy Holden—this time, on stacked microvia reliability, or the lack thereof.

Materials for Automotive Applications: Thermal Management Issues

07/02/2020 | Pete Starkey, I-Connect007
For Pete Starkey, the highlight of the recent HDP User Group Automotive Technology Webinar was Alun Morgan’s presentation on materials for automotive applications. This forward-looking informational session covered the latest developments in automotive standards and automotive electronic packaging.



Copyright © 2020 I-Connect007. All rights reserved.