-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Insulectro to Distribute Pacothane Products Across Canada
February 18, 2019 | InsulectroEstimated reading time: 1 minute
Insulectro, the largest distributor of materials for use in the printed circuit board and printed electronics industries, has announced it will distribute Pacothane lamination-assist products across Canada beginning April 1, 2019. Insulectro has distributed the popular PCB lamination products in the US for decades.
“Today we are announcing our distribution expansion of Pacothane across North America to include Canada,” Insulectro President and CEO Patrick Redfern commented. “For years, we have offered most of our best-in-class materials to Canadian PCB fabricators and adding Pacothane strengthens our already robust line card.”
Pacothane Technologies is the world's leading manufacturer of products to enhance and assist the production and quality assurance process for the lamination and manufacture of printed circuit boards (PCB).
Pacothane services the worldwide PCB and Smart Card markets, which includes rigid multilayer, rigid-flex, coverlayer flex, flexible multilayer, copper and unclad laminates. These circuit boards are integrated into a wide variety of applications and markets that include telecom, data communications, high speed computing, mobile devices, military, smart cards, medical and effectively all electronic products.
Best-selling products include Pacothane release films, PacoPads and Tripak press pads as well as PacoGard slip sheets and Paco-Via high-temperature release films. A line of conformable pads and release sheets include Pacothane Plus, PacoFlex Ultra, ThermoPads, and ThermoFilm.
Paco-Clutch is a new all-in-one conformable release film package that is specifically engineered for use by PCB multilayer manufacturers that laminate etched copper laminate cores, in place of copper foil in the outer layer construction.
“We are proud to extend our relationship with Pacothane and expand our line with the new Paco technology products. With eleven stocking locations in North America, including Canada, Insulectro carries inventory near our customers for maximum availability,” Redfern concluded.
Insulectro supplies advanced engineered materials manufactured by Isola, DuPont, LCOA, CAC, Inc., Pacothane, Focus Tech Chemicals, EMD Performance Materials, Shikoku and Oak Mitsui.
These products are used by its customers to fabricate complex, multilayer circuit boards and to manufacture printed electronics components. Insulectro serves a broad customer base manufacturing rigid, rigid-flex and flexible circuit boards for applications in a variety of end markets including aeronautics, telecom, data communications, high speed computing, mobile devices, military, and medical. Insulectro combines its premier product offering with local inventory across North America, fabrication capabilities and backed up by expert customer and technical support services.
Suggested Items
Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2
04/24/2024 | Vern Solberg -- Column: Designer's NotebookThe printed circuit board (PCB) is the primary base element for providing the interconnect platform for mounting and electrically joining electronic components. When assessing PCB design complexity, first consider the component area and board area ratio. If the surface area for the component interface is restricted, it may justify adopting multilayer or multilayer sequential buildup (SBU) PCB fabrication to enable a more efficient sub-surface circuit interconnect.
Insulectro’s 'Storekeepers' Extend Their Welcome to Technology Village at IPC APEX EXPO
04/03/2024 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, welcomes attendees to its TECHNOLOGY VILLAGE during this year’s IPC APEX EXPO at the Anaheim Convention Center, April 9-11, 2024.
ENNOVI Introduces a New Flexible Circuit Production Process for Low Voltage Connectivity in EV Battery Cell Contacting Systems
04/03/2024 | PRNewswireENNOVI, a mobility electrification solutions partner, introduces a more advanced and sustainable way of producing flexible circuits for low voltage signals in electric vehicle (EV) battery cell contacting systems.
Heavy Copper PCBs: Bridging the Gap Between Design and Fabrication, Part 1
04/01/2024 | Yash Sutariya, Saturn Electronics ServicesThey call me Sparky. This is due to my talent for getting shocked by a variety of voltages and because I cannot seem to keep my hands out of power control cabinets. While I do not have the time to throw the knife switch to the off position, that doesn’t stop me from sticking screwdrivers into the fuse boxes. In all honesty, I’m lucky to be alive. Fortunately, I also have a talent for building high-voltage heavy copper circuit boards. Since this is where I spend most of my time, I can guide you through some potential design for manufacturability (DFM) hazards you may encounter with heavy copper design.
Trouble in Your Tank: Supporting IC Substrates and Advanced Packaging, Part 5
03/19/2024 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite or carbon dispersion are quickly gaining acceptance worldwide. Indeed, the environmental and productivity gains one can achieve with these processes are outstanding. In today’s highly competitive and litigious environment, direct metallization reduces costs associated with compliance, waste treatment, and legal issues related to chemical exposure. What makes these processes leaders in the direct metallization space?