-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Rogers to Exhibit Latest Material Solutions at IPC APEX EXPO 2019
January 23, 2019 | Rogers CorporationEstimated reading time: 3 minutes
Rogers Corporation will be exhibiting at the IPC APEX EXPO 2019, January 29 through January 31, at the San Diego Convention Center in San Diego, California. The IPC APEX EXPO is the leading event for the printed circuit board and electronics manufacturing and assembly industry, providing a full technical conference along with the exhibitor expo.
Rogers Corp. (booth #117) will be exhibiting a wide array of its high-performance circuit materials, including thin RO4000 materials for use in advanced millimeter wave multi-layer designs, high impedance laminates for antennas, and a newly introduced laminate for use in radar sensors. It will also contribute to the technical conference with a presentation on January 29 by John Coonrod, technical marketing manager.
New Laminate for Radar Sensors
Rogers will showcase its recently launched RO3003G2laminate for use in radar sensor designs. RO3003G2 laminates build on Rogers’ industry leading RO3003 platform to provide radar sensor designers with improved insertion loss and reduced dielectric constant (Dk) variation.
The combination of optimized resin and filler content along with the introduction of Very Low Profile ED copper translates to a Dk of 3.00 @ 10 GHz (clamped stripline method) & 3.07 @ 77 GHz (microstrip differential phase length method).
These laminates also show very low insertion loss of 1.3dB/inch for 5 mil laminates as measured by the microstrip differential phase length method.
RO4000 Products for Multi-Layer Structures:
RO4000 Thin Materials are next generation products designed to meet the existing and emerging needs of advanced millimeter wave multi-layer designs.
RO4835T laminates, offered in a 2.5 mil, 3 mil and 4 mil core thickness, are 3.3 Dk, low loss, spread glass reinforced, ceramic filled thermoset materials designed for inner-layer use in multilayer board designs, and complement RO4835 laminates when thinner cores are needed. RO4450T Bonding Materials are 3.2-3.3 Dk, low loss, spread glass reinforced, ceramic filled bonding materials that were designed to complement RO4835T and the existing RO4000 laminate family, and come in 3 mil, 4 mil or 5 mil thicknesses.
RO4835T laminates and RO4450T bonding materials exhibit excellent Dk control for repeatable electrical performance, a low z axis expansion for plated through hole reliability, and are compatible with standard epoxy/glass (FR-4) processes.
These materials are an excellent choice for multilayer designs requiring sequential laminations, as fully cured RO4000 products are capable of withstanding multiple lamination cycles. RO4835T laminate and RO4450T bondply have the UL 94 V-0 flame retardant rating, and are compatible with lead-free processes.
Lastly, CU4000 and CU4000 LoPro Foilsare sheeted foil options for designers looking for foil lamination builds, and provide good outer layer adhesion when used with RO4000 products.
Page 1 of 2
Suggested Items
Insulectro’s 'Storekeepers' Extend Their Welcome to Technology Village at IPC APEX EXPO
04/03/2024 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, welcomes attendees to its TECHNOLOGY VILLAGE during this year’s IPC APEX EXPO at the Anaheim Convention Center, April 9-11, 2024.
ENNOVI Introduces a New Flexible Circuit Production Process for Low Voltage Connectivity in EV Battery Cell Contacting Systems
04/03/2024 | PRNewswireENNOVI, a mobility electrification solutions partner, introduces a more advanced and sustainable way of producing flexible circuits for low voltage signals in electric vehicle (EV) battery cell contacting systems.
Heavy Copper PCBs: Bridging the Gap Between Design and Fabrication, Part 1
04/01/2024 | Yash Sutariya, Saturn Electronics ServicesThey call me Sparky. This is due to my talent for getting shocked by a variety of voltages and because I cannot seem to keep my hands out of power control cabinets. While I do not have the time to throw the knife switch to the off position, that doesn’t stop me from sticking screwdrivers into the fuse boxes. In all honesty, I’m lucky to be alive. Fortunately, I also have a talent for building high-voltage heavy copper circuit boards. Since this is where I spend most of my time, I can guide you through some potential design for manufacturability (DFM) hazards you may encounter with heavy copper design.
Trouble in Your Tank: Supporting IC Substrates and Advanced Packaging, Part 5
03/19/2024 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite or carbon dispersion are quickly gaining acceptance worldwide. Indeed, the environmental and productivity gains one can achieve with these processes are outstanding. In today’s highly competitive and litigious environment, direct metallization reduces costs associated with compliance, waste treatment, and legal issues related to chemical exposure. What makes these processes leaders in the direct metallization space?
AT&S Shines with Purest Copper on World Recycling Day
03/18/2024 | AT&SThe Styrian microelectronics specialist AT&S is taking World Recycling Day as an opportunity to review the progress that has been made in recent months at its sites around the world in terms of the efficient use of resources: