Ventec Expands Global OEM and US-Sales Team with Two New Hires in the USA


Reading time ( words)

Ventec International Group Co., Ltd., a world leader in the production of polyimide and high reliability epoxy laminates and prepregs and specialist provider of thermal management and IMS solutions, has appointed Lynn Kahler (East US) and Ken Butte (West US) as OEM marketing managers. As part of the US-Sales team as well as the Global OEM Team, their focus lies on markets requiring high-speed/low-loss solutions and applications where signal integrity is essential.

With over 35 years of technical experience in the electronics manufacturing industry, including roles at Schlumberger Well Services, Compaq Computer, and NCR with design and program management experience and engineering roles at Merix Corporation, Perfect Circuit International and most recently Sanmina, Lynn Kahler brings with him extensive knowledge of the PCB industry, along with an impressive network of leading contacts that he has nurtured through years of experience in the industry. Based in Texas, Lynn takes on responsibility for customers in the Eastern region of the USA.

Ken Butte further strengthens Ventec’s presence as a world-class provider of high-performance copper clad laminates and prepregs with his deep understanding the PCB industry gained from his impressive career that spans more than 35 years working for companies such as Northrop Grumman NSD, Arlon/Rogers Corp and EMC Materials. His extensive experience and proven account management skills enable Ken to confidently offer Ventec’s Western US OEM customers the right advice for the selection and specification of materials that ensure optimum product performance and cost-effectiveness without compromising manufacturability or functionality.

"We are delighted that Lynn and Ken have joined our Global OEM Group and US-Sales team. They both know the PCB industry inside and out, understand PCB materials and know the requirements of OEM customers. I am very pleased to welcome them to Ventec," said Jack Pattie, president of Ventec USA.

About Ventec International Group

Ventec International is a premier supplier to the Global PCB industry. With volume manufacturing facilities in Taiwan and China and distribution locations and manufacturing sites in both the US and Europe, Ventec specializes in advanced copper clad glass reinforced and metal backed substrates. Ventec materials, which include high-quality enhanced FR4, high-speed/low-loss- & high-performance IMS material technology and an advanced range of thermal management solutions, are manufactured by Ventec using strict quality-controlled processes that are certified to AS9100 Revision D, IATF 16949:2016 and ISO 9001:2015, and are backed by a fully controlled and managed global supply chain, sales- and technical support-network.

Visit I-007eBooks to download your copy of Ventec micro eBook today:
The Printed Circuit Designer's Guide to...Thermal Management with Insulated Metal Substrates

Share

Print


Suggested Items

ESI’s Chris Ryder: There’s More to Choosing a Laser Than You Think

01/16/2019 | Barry Matties, I-Connect007
At the recent HKPCA show, I sat down with ESI’s Chris Ryder, director of product management—HDI—to discuss considerations for choosing a new laser system, and how ESI uses its decades of flex and rigid-flex drilling experience to help guide customers in their decision-making process.

Agfa on Revolutionary Inkjet Solder Mask Applications

01/10/2019 | Pete Starkey, I-Connect007
Does inkjet solder mask have the potential for volume production? Mariana Van Dam, Global Sales Manager PCB Imaging Solutions, and Dr. Frank Louwet, Business Unit Manager Advanced Coatings & Chemicals, discuss Agfa's latest developments, plus some novel applications for inkjet etch and plating resists.

Robert Art on the Importance of Thermal Management

01/07/2019 | Pete Starkey, I-Connect007
Robert Art, global account manager for IMS materials at Ventec International Group, discusses future market requirements for thermal management materials, the need for a better understanding of the concept of thermal impedance, and an initiative to propose a consistent industry-standard method for measuring thermal conductivity while at electronica 2018.



Copyright © 2019 I-Connect007. All rights reserved.