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Taiflex Scientific Co. Ltd, a Taiwan-based supplier of flexible copper-clad laminates (FCCL) and PV module backsheets, has posted consolidated revenue of NT$919 million ($29.86 million) for October, down by 3.7% from the previous month and by 8.3% year-on-year. For January to October, total sales reached NT$8.152 billion ($264.79 million), down by 12.5% compared with the same period last year.
Revenue for the Electronic Materials (EM) business totaled NT$853 million ($27.7 million), slightly down by 0.72 month-on-month, but up by 16.9% year-on-year. For the PV segment, revenue reached NT$51 million ($1.66 million), down by 34% on-month and by 80.7% on-year.
Pete Starkey, I-Connect007
The UK chapter of the global IMAPS community of electronics and microelectronic packaging engineers shared a wealth of knowledge and wisdom about PCB substrate technology trends, developments, and future requirements in a webinar on the first of November.
E. Walch, DJ., C. Rietmann, Ph.D., and A. Angstenberger, Ph.D.
The industry is seeing ever-more stringent requirements of interconnect technologies (ICT) from die through final assembly, in particular digital and analog high frequencies, undistorted signal propagation and efficient heat propagation are concerned.
Tara Dunn, OMNI PCB
SAP, mSAP, SLP—what kind of crazy acronyms have we adopted now, and how much do you really need to know? In terms of consumer electronics, there is a good chance that the smartphone attached to your hand at all times contains a PCB fabricated with this technology—or at the very least, the next-generation smartphone that you purchase will utilize mSAP technology.