EIPC SpeedNews: News from the European PCB Industry


Reading time ( words)

News from Germany

- Reducing Manufacturing Costs Through Upscaling Panel Size for Copper Plating on Fan-Out Panel-Level Packaging (FO-PLP)

- Technolam Appoints Roland Schönholz as Technical Marketing Manager

- Atotech's Surface Finish Specialist Rick Nichols a Presenter and Panelist at SMTA International 2018

Electronics Industry News

- New eBook Promotes Automation and Advanced Procedures in PCB Fabrication

- Shortages & Price Hikes Leave Supply Chain in Disarray

- Analysts Foresee Supply Chain Impact from Chip Hack Report

News from Italy

- Seica Publishes Video on New Compact Slim Next> Series

News from Spain 

- Smart Systems Integration Barcelona, Spain, April 10–11, 2019

News from Switzerland 

- Dyconex to Exhibit at electronica 2018 and expoAIR

News from the UK 

- Ventec International Group's Martin Cotton Retires

- pOp 2: The 2nd International Conference on Photonics & Optoelectronics Packaging

- Polar October News - Limitless Drill Documentation / electronica

News from the USA 

- Aegis Software and Inovaxe Partner to Deliver Integrated MES and Material Handling & Storage Solution for Ultra-Lean Manufacturing

News from WECC Members 

Click here for the International Events Diary 2018

Share

Print


Suggested Items

Ventec Focuses on High-mix Manufacturing

04/09/2019 | Barry Matties, I-Connect007
The I-Connect007 team recently toured Ventec International Group’s Suzhou factory where a modern, flexible manufacturing concept designed for fast delivery is enhancing their established volume manufacturing of specialty, high-reliability epoxy laminates and prepregs. Read on to know more about Ventec's ongoing investment in the facility to offer flexible world-class high-mix manufacturing capabilities for polyimide, thermal management, low-loss, and signal integrity material solutions.

EIPC Winter Conference, Day 1

03/19/2019 | Alun Morgan, EIPC
EIPC Chairman Alun Morgan writes about the highlights of and the technical discussions at the recent EIPC Winter Conference held in Milan last February 14–15.

Institute of Circuit Technology Evening Seminar

03/05/2019 | Martin Goosey
The Institute of Circuit Technology hosted its first 2019 seminar at the Woodland Grange Hotel in Royal Leamington Spa in the Midlands of England on February 26. The diverse programme of four presentations was introduced by ICT Chairman Andy Cobley, a professor at Coventry University, who stood in for Bill Wilkie, who had been taken ill at short notice.



Copyright © 2019 I-Connect007. All rights reserved.