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The flex market continues to be one of the fastest growing segments of the circuit board industry, mainly driven by the significant rise in the consumer electronics sector. But manufacturers are having to navigate critical challenges that rock their boat when faced with assembling flexible printed circuits.
In the June 2018 issue of SMT007 Magazine, we examine these concerns and highlight some of the strategies and techniques used to address them.
Read the June 2018 issue of SMT007 Magazine, now on the virtual newsstand, and available for delivery in your e-mailbox by subscribing here.
Be sure to download the PDF version for future reference.
Stephen Las Marias, I-Connect007
At the recent NEPCON China 2018 event in Shanghai, I spoke with Ralf Wagenfuehr, plant manager at Rehm Thermal Systems, to gain insight into flex circuit assembly, and the challenges of reflow soldering. He also speaks about the need for industry forums focused on soldering flex printed circuits.
Real Time with... NEPCON China
At the recent NEPCON China 2018 event in Shanghai, Ralf Wagenfuehr, plant manager at Rehm Thermal Systems in China, speaks with I-Connect007’s Stephen Las Marias about their latest advancements in reflow oven technology, as well as on strategies to reduce voiding.
Real Time With... NEPCON South China
Ralf Wagenfuehr of Rehm Thermal Systems speaks about the need for a common communications platform as the industry moves toward Industry 4.0. He also talks about how their new ViCON software can help manufacturers achieve the smart factory vision.