June 2018 Issue of SMT007 Magazine Available Now

Reading time ( words)

The flex market continues to be one of the fastest growing segments of the circuit board industry, mainly driven by the significant rise in the consumer electronics sector. But manufacturers are having to navigate critical challenges that rock their boat when faced with assembling flexible printed circuits.

In the June 2018 issue of SMT007 Magazine, we examine these concerns and highlight some of the strategies and techniques used to address them.

Read the June 2018 issue of SMT007 Magazine, now on the virtual newsstand, and available for delivery in your e-mailbox by subscribing here.

Be sure to download the PDF version for future reference.


Suggested Items

RTW NEPCON CHINA: Rehm Discusses Reflow Strategies to Reduce Voiding

05/10/2018 | Real Time with... NEPCON China
At the recent NEPCON China 2018 event in Shanghai, Ralf Wagenfuehr, plant manager at Rehm Thermal Systems in China, speaks with I-Connect007’s Stephen Las Marias about their latest advancements in reflow oven technology, as well as on strategies to reduce voiding.

RTW NEPCON South China: Rehm on Machine Communications and Vacuum Technology in Reflow

09/13/2017 | Real Time With... NEPCON South China
Ralf Wagenfuehr of Rehm Thermal Systems speaks about the need for a common communications platform as the industry moves toward Industry 4.0. He also talks about how their new ViCON software can help manufacturers achieve the smart factory vision.

RTW IPC APEX EXPO: Rehm Discusses Advantages of Moving Heat Technology

04/20/2016 | Real Time with...IPC
Rehm Thermal Systems general manager Paul Handler speaks with I-Connect007 guest editor Steve Williams about the advantages of the moving heat chamber compared to traditional technology in the market today, and why their systems are all Industry 4.0-ready.

Copyright © 2018 I-Connect007. All rights reserved.