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The flex market continues to be one of the fastest growing segments of the circuit board industry, mainly driven by the significant rise in the consumer electronics sector. But manufacturers are having to navigate critical challenges that rock their boat when faced with assembling flexible printed circuits.
In the June 2018 issue of SMT007 Magazine, we examine these concerns and highlight some of the strategies and techniques used to address them.
Read the June 2018 issue of SMT007 Magazine, now on the virtual newsstand, and available for delivery in your e-mailbox by subscribing here.
Be sure to download the PDF version for future reference.
Real Time With... NEPCON South China
Ralf Wagenfuehr, plant manager of Rehm Thermal Systems (Dongguan) Ltd, speaks with I-Connect007’s Edy Yu about the developments in the company’s convection reflow soldering system, which features a vacuum module, aimed at addressing the increasing demand for vacuum soldering. He also discusses their software developments, as well as how they are helping their customers toward their Industry 4.0 journey.
Stephen Las Marias, I-Connect007
At the recent NEPCON China 2018 event in Shanghai, I spoke with Ralf Wagenfuehr, plant manager at Rehm Thermal Systems, to gain insight into flex circuit assembly, and the challenges of reflow soldering. He also speaks about the need for industry forums focused on soldering flex printed circuits.
Real Time with... NEPCON China
At the recent NEPCON China 2018 event in Shanghai, Ralf Wagenfuehr, plant manager at Rehm Thermal Systems in China, speaks with I-Connect007’s Stephen Las Marias about their latest advancements in reflow oven technology, as well as on strategies to reduce voiding.