Printed Circuits Upgrades Photo Department


Reading time ( words)

Flex and rigid flex circuit board manufacturer Printed Circuits has added two new pieces of equipment to their photo department including a new Orbotech Paragon 8-watt laser direct imager and a Fusion 22 automatic optical inspection machine with laser via inspection capabilities.

"We purchased a 16-watt laser direct imager a few years back and needed to add capacity, particularly for inner and outer layer photoimaging," said Matt Tannehill, executive vice president. "The new LDI uses LSO, or large scan optics, for very high throughput with excellent quality at the same time, which is critical for our customers' success.  The new machine also has a very wide depth of field, which is ideal for manufacturing flex and rigid flex circuits as they can often have a great deal of topography on the outer layer surfaces. We are extremely pleased to have this new capability."

"The Fusion 22 AOI machine is a natural complement to the laser direct imager. It is designed for laser via inspection and HDI applications that have become increasingly popular. With a very high throughput and low false defect rate, the Fusion greatly enhances our productivity in that department," Matt continued. "We are pleased to continue to augment our capabilities to meet our customers' expectations today and in the future."

About Printed Circuits

Printed Circuits is a US manufacturer of multilayer flex and rigid flex printed circuit boards with over 40 years of experience building circuits typically used in high reliability applications such as medical, military and commercial electronics where customers place a premium on reliability, package density, and weight. For more information, click here.

Share


Suggested Items

Calumet Electronics on IMPACT 2018

08/14/2018 | Patty Goldman, I-Connect007
This year at IMPACT Washington, DC, I-Connect007's Patty Goldman sat down with Steve Vairo and Mike Kadlec of Calumet Electronics, to get their overview on the event.

Agfa: Staying Ahead of the Technology Curve

08/01/2018 | Barry Matties, I-Connect007
In the ultracompetitive electronics manufacturing space, companies that don’t continually evolve and invest in new technologies run the risk of being left behind. At the recent EIPC summer conference, many next-generation processes and technologies were discussed and even put on display.

An Owner’s Positive Take on IMPACT 2018: American Standard Circuits’ Founder & Chairman Gordhan Patel

07/31/2018 | Patty Goldman, I-Connect007
During a full day at IMPACT 2018, I had a chance to speak with American Standard Circuits’ founder and chairman Gordhan Patel. We had much to talk about after listening to several speakers from the departments of Defense and Education, and the International Trade Administration.



Copyright © 2018 I-Connect007. All rights reserved.