Reading time ( words)
During the 2017 International Printed Circuit & APEX South China Fair (HKPCA & IPC Show 2017) in Shenzhen, IPC Asia President Philip S. Carmichael speaks with I-Connect007 Managing Editor Stephen Las Marias about the move in the value chain that’s driving the electronics manufacturing industry forward. He speaks about the new market trends that will further the growth of the PCB industry, as well as how new manufacturing technologies will help bring the industry towards the vision of a lights-out factory.
Finally, Carmichael talks about the need for knowledge transfer, education, and standards, in the industry.
Watch The Interview Here
Stephen Las Marias, I-Connect007
At the recent HKPCA and IPC Show 2017 in Shenzhen, China, I was able to interview Les Sainsbury, CEO, and Andrew Kelley, CTO, of XACT PCB, as well as Alex Stepinski, vice president of Whelen Engineering’s PCB Fab Business Unit, to discuss process evolution and technology developments in the PCB manufacturing industry.
Patty Goldman, I-Connect007
This month, we will discuss the equipment purchasing decision-making process. How many of you can recall the earliest “dippy dunk” PCB shops, so-called because that’s exactly how it was done? There were no conveyorized lines, no automatic hoists, no load/unload stations, maybe not even a lab for analyzing the plating baths.
Pete Starkey, I-Connect007
The first day of the conference had started and ended in the dark—a long and technically intense day! After a convivial conference dinner and a good night’s sleep we were back on the bus, this time in daylight at the slightly later time of 8:00 a.m., for the journey from downtown Lyon back to Alstom’s conference facility in Villeurbanne, and it wasn’t raining. In fact, there was even some sunshine later in the day!