Reading time ( words)
IPC—Association Connecting Electronics Industries will be holding a Flexible Circuits-HDI Forum on October 17–18, 2017 in Minneapolis, Minnesota.
IPC Flexible Circuits – HDI Forum is two days of professional development offering instruction and tutorials for the electronics industry. With topics ranging from flexible circuit metallization to designing a reliable and cost-effective HDI-circuit, this event promises to provide quality education and networking opportunities. Additional topics to be discussed include how to transition customers on leading edge technology from prototype to production, as well as solderable finishes for flex boards, and rigid-flex signal integrity.
To register, click here.
Patty Goldman, I-Connect007
Every year IPC presents dozens of awards to committee members for their work completing standards and specifications and for other activities within the organization. However, a few awards are extra special and presented for extraordinary efforts, for long-time commitment to both IPC and the electronics industry.
On the last morning of IPC APEX EXPO 2018, we met with Nancy Jaster, IPC design programs manager and one of the driving forces behind IPC’s STEM Outreach program for high school students. We spoke about the students who were arriving on site at IPC APEX EXPO, and what the industry, and IPC, hoped to achieve with this valuable program.
Barry Matties, I-Connect007
With the recent planned acquisition of Orbotech in place by maker KLA-Tencor, much of the industry has speculated about Orbotech’s future. Barry Matties spoke with CEO Asher Levy about what lies in store for the Orbotech group and, more specifically, their PCB division should the deal close.