EIPC SpeedNews: News from the European PCB Industry


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News from the EIPC

- Call for Papers for EIPC Winter Conference Lyon, France, February 1–2, 2018

News from Germany

- SMT Hybrid Packaging 2018: Call for Tutorials Launched

- Schweizer Electronic AG: Preliminary Figures for the First Half Year 2017 and Adjustment of Forecast 

Electronic Industry News

- IoT Growth Slower than Expected

- Made in China 2025: Make or Break for Europe?

News from the UK

- Forthcoming SMART Dates for 2017

- IMAPS News for July 2017.... Holiday Time is Coming!

- The "RELPACK" Reliability Conference

News from the USA 

- Ventec's Martin Cotton Joins Speaker Line-up at Advancements in Thermal Management Conference 2017

News from WECC Members    

Click here for the International Events Diary 2017

Click here to download the complete SpeedNews Issue 23

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03/15/2018 | Thy-An Tran, Pioneer Circuits Inc.
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Weiner’s World—December 2017

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Hold on to your seats! 2018 will be a year full of rapid changes, surprises, and growth. M&A activities will flourish. The supply chain will suffer shortages and changes as demand increases, copycats will rush to market, and new markets and potential suppliers will vanish before they are established.



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