EIPC SpeedNews: News from the European PCB Industry


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News from the EIPC

- Call for Papers for EIPC Winter Conference Lyon, France, February 1–2, 2018

News from Germany

- SMT Hybrid Packaging 2018: Call for Tutorials Launched

- Schweizer Electronic AG: Preliminary Figures for the First Half Year 2017 and Adjustment of Forecast 

Electronic Industry News

- IoT Growth Slower than Expected

- Made in China 2025: Make or Break for Europe?

News from the UK

- Forthcoming SMART Dates for 2017

- IMAPS News for July 2017.... Holiday Time is Coming!

- The "RELPACK" Reliability Conference

News from the USA 

- Ventec's Martin Cotton Joins Speaker Line-up at Advancements in Thermal Management Conference 2017

News from WECC Members    

Click here for the International Events Diary 2017

Click here to download the complete SpeedNews Issue 23

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