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The June 2017 issue of The PCB Magazine is now available.
Embedded technology seems finally to be coming into its own—thanks to Moore’s Law and the ever-pressing need for more real estate on the circuit board surface. No longer just for the odd, expensive military product, buried components can be found in that most ubiquitous of consumer products, the smartphone, as you will learn in this issue. They are truly all around us!
Read all about it this month in The PCB Magazine, now on the virtual newsstand and available for free delivery in your e-mailbox by subscription. Register with my I-Connect007 to manage all of your subscriptions through your own dashboard.
Be sure to download the PDF version to your devices for handy future reference.
Patty Goldman, I-Connect007
While at IPC APEX EXPO a few weeks ago, I sat down with George Hsin, chief strategy officer for TUC Worldwide, and Alan Cochrane, president of TUC North America. I was interested in learning more about the company and their laminate products and Alan was happy to fill me in.
Barry Matties, I-Connect007
Barry Matties met with Orbotech’s corporate VP of Business Development and CMO, Lior Maayan, in Shenzhen and spoke about the next-generation processes currently challenging Orbotech's R&D team. Most notable among them are additive technologies like the automated optical shaping solution, and the growth of MSAP, flex, and HDI.
Real Time with...IPC
Philipp Menges, president of Cirexx International, discusses yearly company updates and growing markets, including automotive, medical, and military.