Meyer Burger Supplies CONx Microfab R&D and Pilot Production System at NextFlex


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Meyer Burger, in partnership with DuPont, Eastman Chemical and Intrinsiq Materials, is delivering a CONx Microfab cluster tool that includes two PiXDRO IP410 inkjet printing systems, a FLEx LT PECVD deposition system, automation, and on-board metrology that will enable multilayer, multi material additive depositions for complex FHE structures.

Meyer Burger’s fully automated GEN2.5 multi-process CONx Microfab will be used to manufacture FHE (Flexible Hybrid Electronics) devices and will leverage key partners’ materials for development and product prototyping. The dual-station dual-head inkjet printing capability enables real-time metrology for advanced process control and world-record sub-15-micron feature-size printing. Maximum flexibility in product prototyping is achieved by quick change-outs of digital image, recipe and print head assembly thereby substantially shortening time-to-market and significantly reducing risk in volume ramp-up.

NextFlex, America’s Flexible Hybrid Electronics Manufacturing Institute was formed in 2015, by the Department of Defense (DoD) and FlexTech Alliance to advance manufacturing of FHE in the US. As part of its mission, NextFlex is issuing project awards for promising applications that focus on establishing capability in critical gap areas for flexible hybrid electronics manufacturing. This clearly demonstrates the continued confidence of industry leaders in the widespread adoption of FHE and helps transform FHE into a commercially viable industry. The field of flexible electronics is very promising, and the development of hybrid manufacturing capabilities that include printing and traditional silicon-based electronics is seen as a strong option going forward.

For more information visit our booth 3013 at the upcoming FLEX Conference (June 19-22, 2017) in Monterey, CA (USA) where Meyer Burger is going to present the latest developments in CONx systems as well as technology and applications specific to FHE.

About Meyer Burger Technology Ltd

Meyer Burger is a leading global technology company specialising on innovative systems and processes based on semiconductor technologies. The company’s focus is on photovoltaics (solar industry) while its competencies and technologies also cover important areas of the semiconductor and the optoelectronic industries as well as other selected high-end markets based on semiconductor materials. Over the past ten years, Meyer Burger has risen to the forefront of the photovoltaic market and established itself as an international premium brand by offering superior precision products and innovative technologies. 

Meyer Burger’s offering in systems, production equipment and services along the photovoltaic value chain includes the manufacturing processes for wafers, solar cells, solar modules and solar systems. Meyer Burger provides substantial added value to its customers and clearly differentiates itself from its competitors by focusing on the entire value chain.   

The company’s comprehensive product portfolio is complemented by a worldwide service network with spare parts, consumables, process know-how, customer support, after-sales services, training and other services. Meyer Burger is represented in Europe, Asia and North America in the respective key markets and has subsidiaries and own service centres in China, Germany, India, Japan, Korea, Malaysia, the Netherlands, Switzerland, Singapore, Taiwan and the USA. The company is also working intensively to develop new markets such as South America, Africa and the Arab region. The registered shares of Meyer Burger Technology Ltd are listed on the SIX Swiss Exchange.

About Flexible Hybrid Electronics FHE gives everyday products the power of silicon ICs by combining them with new and unique printing processes and new materials. The result: lightweight, low-cost, flexible, conformable, stretchable, and highly efficient smart products with innumerable uses for consumer, commercial and military applications.

About NextFlex

NextFle, America’s Flexible Hybrid Electronics Manufacturing Institute, is a leading force in the Manufacturing USA network. Formed through a cooperative agreement between the U.S. Department of Defense (DoD) and FlexTech Alliance, NextFlex is a consortium of companies, academic institutions, nonprofits and state, local and federal governments with a shared goal of advancing U.S. manufacturing of FHE. Since its formation in 2015, NextFlex®'s elite team of thought leaders, educators, problem solvers and manufacturers have come together to collectively facilitate innovation, narrow the manufacturing workforce gap and promote sustainable manufacturing ecosystems.

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