-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
Article Highlights
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
2017FLEX Monterey Focuses on Accelerating to Manufacturing as Industry Growth Escalates
May 16, 2017 | FlexTechEstimated reading time: 2 minutes
FlexTech’s annual Flexible Electronics Conference and Exhibit – 2017FLEX – is set for the Hyatt Regency Hotel & Spa in Monterey, California from June 19-22, 2017. Consistently attracting more than 500 registrants, the event is the premier technology conference for the emerging flexible electronics industry. Twenty-six sessions will cover the landscape of flexible hybrid electronics and printed electronics, including R&D, manufacturing and applications. Short courses and networking events round out 2017FLEX.
According to Zion Research, “global demand for the flexible electronics market was valued at $5.13 billion in 2015 and is expected to generate revenue of $16.5 billion by 2021, growing at a CAGR of slightly above 21% between 2016 and 2021.” Key elements of the market include flex displays, sensors, batteries, and memory. Applications also abound in the automotive, consumer electronics, healthcare, and industrial sectors.
While technology advancement and accelerating to manufacturing are the primary themes of the FLEX Conference, applications and business trends are highlighted on the opening day:
- Applied Materials Keynote by Brian Shieh, corporate VP and GM, Display Business Group, on the flexible display market
- Flex, the global EMS provider, and NextFlex, America’s Flexible Hybrid Electronics Manufacturing Institute, on the challenges and solutions for manufacturing flexible and stretchable electronics
- Libelium on how new IOT platforms that integrate sensors to monitor and control body parameters will lead to better healthcare for billions
- Experience Co-Creation Partnership on the ten starting points for the development of flexible/hybrid sensors for agriculture and food
- NovaCentrix on the OE-A Roadmap 2017, giving an outlook on organic and printed electronics developments and prospects
- Gartner Group on when flexible electronics will reach critical mass
Sessions are planned for FHE manufacturing, standards and reliability, substrates, conductors, inspection, encapsulation and coating, nanoparticle inks, direct write, and 3D printing, among others. Well-known companies will present, such as Molex, Panasonic, Eastman Chemical, and Northrup Grumman, as well as leading universities, and the U.S. Army and U.S. Air Force Research Laboratories.
Among the R&D organizations presenting at 2017FLEX are CEA-LITEN (France), ETRI (South Korea), Flexible Electronics & Display Center (USA), Fraunhofer Institute (Germany), Holst Center (Netherlands), National Research Council (Canada), PARC (USA), and VTT (Finland). Topics of the presentations range from new forms of flexible substrates to TFT and OLED pilot lines to printed health monitoring sensors.
The exhibit floor, short courses and networking opportunities round out the event, as well as many member-only meetings. FlexTech, the Nano-Bio Manufacturing Consortium (NBMC) and NextFlex hold member and planning meetings for the governing councils, technical councils and technology working groups. Initiatives in manufacturing, mobile power, e-health, as well as project proposals will be discussed, all buoyed by the information shared during the technical conference.
For more information on 2017FLEX, please click here.
About SEMI
SEMI connects nearly 2,000 member companies and 250,000 professionals worldwide annually to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, and services that enable smarter, faster, more powerful, and more affordable electronic products. Since 1970, SEMI has built connections that have helped its members grow, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org.
About FlexTech
FlexTech, a SEMI Strategic Association Partner, is focused on growth, profitability, and success throughout the manufacturing and distribution chain of flexible hybrid electronics, by developing solutions for advancing these technologies from R&D to commercialization. Visit FlexTech at www.flextech.org.
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics
04/24/2024 | I-Connect007 Editorial TeamIn our fast-changing, deeply competitive, and margin-tight industry, factory analytics can be the key to unlocking untapped improvements to guarantee a thriving business. On top of that, electronics manufacturers are facing a tremendous burden to do more with less. If you don't already have a copy of this book, what follows is an excerpt from the introduction chapter of 'The Printed Circuit Assembler’s Guide to... Factory Analytics: Unlocking Efficiency Through Data Insights' to whet your appetite.
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.
Elevating PCB Design Engineering With IPC Programs
04/24/2024 | Cory Blaylock, IPCIn a monumental stride for the electronics manufacturing industry, IPC has successfully championed the recognition of the PCB Design Engineer as an official occupation by the U.S. Department of Labor (DOL). This pivotal achievement not only underscores the critical role of PCB design engineers within the technology landscape, but also marks the beginning of a transformative journey toward nurturing a robust, skilled workforce ready to propel our industry into the future.
Winner of The Science Show Rakett 69 Receives Incap Scholarship
04/24/2024 | IncapThe winner of the Rakett 69 science show, Andri Türkson, who stood out as an electronics enthusiast, received a scholarship from Incap Estonia, along with an internship opportunity in Saaremaa.
Alternative Manufacturing Inc. Awarded QML Requalification to IPC J-STD-001 and IPC-A-610
04/24/2024 | IPCIPC's Validation Services Program has awarded an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) requalification to Alternative Manufacturing Inc (AMI).