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Mark Goodwin, COO of USA and Europe for Ventec International Group, and Jack Pattie, CEO of Ventec USA, discuss the effect of current material issues on the supply chain for copper-clad laminate, comment upon prospects for the future and stress the importance of customer-supplier relationships in forecasting and planning requirements.
Watch the interview here.
Pete Starkey, I-Connect007
The UK chapter of the global IMAPS community of electronics and microelectronic packaging engineers shared a wealth of knowledge and wisdom about PCB substrate technology trends, developments, and future requirements in a webinar on the first of November.
Tara Dunn, OMNI PCB
SAP, mSAP, SLP—what kind of crazy acronyms have we adopted now, and how much do you really need to know? In terms of consumer electronics, there is a good chance that the smartphone attached to your hand at all times contains a PCB fabricated with this technology—or at the very least, the next-generation smartphone that you purchase will utilize mSAP technology.
Emilie Jolivet, YOLE DÉVELOPPEMENT
The smartphone is one of the high value-add products that carries a very high demand for miniaturization. Customers expect larger screens, cameras with high resolution, and various other functions, in lighter and thinner phones.