Standard of Excellence: Collaboration—The Right Path to Innovation
Global Sourcing Spotlight: Golf, Friedman, and the Benefits of Global Sourcing
Nolan’s Notes: Coming to Terms With AIepoxySet Unveils UC-2210M - Urethane for Electronic Component Protection
April 29, 2024 | epoxySetEstimated reading time: Less than a minute
epoxySet introduces a new and unique, urethane potting compound. The UC-2210M was formulated to protect electronic components in high moisture and thermal environments including constant atmospheric exposure, oceanographic environments and high humidity conditions.
This room temperature curing system is easy to apply as a potting, encapsulation or casting compound. The low viscosity allows for easy air removal as well as penetration of intricate encapsulated areas.
UC-2210M cures to a semi-rigid polymer that minimizes stresses on delicate and sensitive components. It has good thermally conductive thus further protecting electronics from heat stresses. Offering exceptional thermal shock from -55 to 130 °C, it also provides high impact resistance.
Share on:
Suggested Items
PCB Market Size to Grow by $29.06B from 2024-2028
05/17/2024 | PRNewswireThe global printed circuit board (PCB) market size is estimated to grow by USD 29.06 bn from 2024-2028, according to Technavio. The market is estimated to grow at a CAGR of over 6.6% during the forecast period.
epoxySet Launches EC-1015HP - High Temperature, Crack Resistant Epoxy Potting
05/13/2024 | epoxySetepoxySet introduces the EC-1015HP epoxy potting compound. This heat cure system is designed for temperature cycling from -55 to 180°C with significantly better crack resistance than traditional rigid epoxies. As a low viscosity encapsulant, it is used for large and small potting applications with fragile components.
Micross, Sital Announce Global Manufacturing & Distribution Partnership
05/07/2024 | Micross Components, Inc.Micross Components, Inc., a leading global provider of mission-critical microelectronic components and services for high-reliability aerospace, defense, space and industrial applications, is pleased to announce our exclusive partnership with Sital Technology (sitaltech.com), the leader in MIL-STD-1553 IP cores, specializing in integrated FPGA solutions.
AT&S Brings High-Tech to the Museumsquartier
05/06/2024 | AT&SAT&S, as a “MQ goes Green” partner, has prepared special highlights for the occasion: Visitors aged eight and above can embark on an interactive journey through the fascinating world of microelectronics.
Argonne, Toyota Collaborate on Cutting-Edge Battery Recycling Process
05/01/2024 | BUSINESS WIREThe U.S. Department of Energy’s (DOE) Argonne National Laboratory has recently launched a collaboration with Toyota Motor North America that could reduce the nation’s reliance on foreign sources of battery materials.