Siemens Announces Certifications for TSMC’s Latest Processes
April 28, 2023 | SiemensEstimated reading time: 2 minutes
Siemens Digital Industries Software announced at the TSMC 2023 North America Technology Symposium a range of new certifications and collaborations with longtime partner TSMC, resulting in key achievements toward enabling Siemens EDA technologies for the foundry’s latest process technologies.
Calibre platform certified for N3E processes
Siemens’ industry-leading Calibre® nmPlatform tool for integrated circuit (IC) verification sign-off is now fully certified for TSMC’s advanced N3E and N2 processes, including Calibre® nmDRC software, Calibre® YieldEnhancer™ software, Calibre® PERC™ software, Calibre® xACT™ software and Calibre® nmLVS software.
TSMC and Siemens have also collaborated to certify Siemens’ mPower™ analog software for transistor-level electromigration and IR drop (EM/IR) sign-off for TSMC’s N3E process. This achievement allows mutual customers to apply the mPower solutions’ unique EM/IR signoff solution to their next-generation analog designs. Further, TSMC and Siemens are now collaborating to certify mPower™ digital software for TSMC’s N3E process.
“Our long-standing collaboration with Siemens brings innovative design solutions to our mutual customers and can enable success in the fast-moving semiconductor market,” said Dan Kochpatcharin, head of the Design Infrastructure Management Division at TSMC. “We look forward to continuing to provide our mutual customers with best-in-class technologies and solutions for optimized performance, power, and area.”
New certifications for Analog FastSPICE platform
Siemens’ Analog FastSPICE platform for circuit verification of nanometer analog, radio frequency (RF), mixed-signal, memory, and custom digital circuits has successfully achieved TSMC certification for the foundry’s advanced N5A, N3E, and N2 processes. Further, as part of the custom design reference flow (CDRF) for TSMC’s N3E and N4P processes, Siemens’ Analog FastSPICE platform now supports TSMC’s Reliability Aware Simulation technology, which addresses IC aging and real-time self-heating effects among other advanced reliability features. TSMC’s N4P CDRF also includes Siemens’ Solido™ Variation Designer software for advanced variation-aware verification at high sigma.
New certification for Siemens’ Tanner software
Siemens has also enhanced its Tanner™ software, which helps customers design and lay out their next-generation analog and mixed-signal ICs. By working in close collaboration with the TSMC team to develop the required functionality, Siemens’ Tanner software is now able to efficiently and successfully tape out a design at TSMC’s 16nm node. This achievement is one of many milestones resulting from Siemens’ ongoing investment to massively transform the Tanner portfolio into an enterprise-ready design environment with the ability to support advanced process nodes. Part of this effort includes Siemens’ close collaboration with TSMC on many initiatives, including the establishment of Tanner software iPDK support for legacy nodes, and emerging support for advanced nodes.
“We are excited that our partnership with TSMC is offering innovative new solutions that enable success for our customers,” said Joe Sawicki, EVP of IC EDA at Siemens Digital Industries Software. “These new certifications and milestones further demonstrate our commitment to driving digital transformation in the semiconductor industry with our longtime foundry partner TSMC.”
Suggested Items
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Siemens Delivers New Solido IP Validation Suite
05/07/2024 | SiemensSiemens Digital Industries Software introduced Solido™ IP Validation Suite software, a comprehensive, automated signoff solution for quality assurance across all design intellectual property (IP) types, including standard cells, memories and IP blocks.
Altair Acquires Research in Flight, Forging a New Path for Aerodynamic Analysis
05/07/2024 | AltairAltair a global leader in computational intelligence, announced it has acquired Research in Flight, maker of FlightStream®, which provides computational fluid dynamics (CFD) software with a large footprint in the aerospace and defense sector and a growing presence in marine, energy, turbomachinery, and automotive applications.
Happy’s Tech Talk #28: The Power Mesh Architecture for PCBs
05/07/2024 | Happy Holden -- Column: Happy’s Tech TalkA significant decrease in HDI substrate production cost can be achieved by reducing the number of substrate layers from conventional through-hole multilayers and microvia multilayers of eight, 10, 12 (and more), down to four. Besides reducing direct processing steps, yield will increase as defect producing operations are eliminated.
Hirose Launches Solution Partner Network to Address Changing Design Challenges
05/06/2024 | HiroseHirose, a leader in the design and manufacturing of innovative connector solutions, has established a Solution Partner Network that enables OEMs to quickly explore product design, specialty IP, and component fulfillment options that best suit their needs.