Rogers' Power Electronic Solutions Group to Showcase curamik Ceramic Substrates & ROLINX Eco Busbars at the PCIM 2023
April 26, 2023 | Rogers CorporationEstimated reading time: 2 minutes
Rogers Corporation’s Power Electronics Solutions (PES) group will be exhibiting at PCIM Europe and showcasing the whole curamik® ceramic substrate portfolio and ROLINX® Eco — a new generation aluminum busbar with unique features.
The PCIM Europe (Power Conversion and Intelligent Motion) event is the world's leading exhibition and conference for power electronics, intelligent motion, renewable energy and energy management. It is the leading international platform showcasing current products, topics and trends in power electronics and applications, taking place at the Nuremberg Messe (exhibition hall) in Nuremberg, Germany from May 09 –11, 2023. Rogers will be exhibiting in Hall 9 at Booth 351.
Rogers will also be active on the E-Mobility Forum schedule. Manfred Goetz, Rogers Senior Manager of Product Management for curamik, will present on the topic, “Comparison of Ceramic Substrate Materials for Different Packaging Technologies for Power Electronics.” This presentation will show that with the growth of HEV/EV and increasing requirements for packaging materials, designers struggle to find new ways to ensure reliability and high efficiency of electronic systems, which are necessary to power these new, challenging technologies. Additionally, Goetz will explain why finding and selecting the proper substrate materials for these challenges is the key for success in power electronics.
E-Mobility Forum, Hall 6, Booth 6-220
Tuesday, May 09, 2023, 3:10 pm
Thursday, May 11, 2023, 1:25 pm
Rogers will also be active on the PCIM Europe technical conference schedule and present a paper titled “Development of Method for Thermal Diffusivity Measurement of Thin and High Conductive Ceramics” by Martina Schmirler, Stefan Britting and Karsten Schmidt in cooperation with the Fraunhofer Institute for Ceramic Technologies and Systems IKTS, Germany. This paper will show that reliable operation of power modules under all conditions that may occur during their lifetime must be achieved by design, and that thermal simulation is an important tool to optimize the thermal design with respect to chip temperature. This paper will elaborate that it has identified a reliable method for determining thermal diffusivity by comparing different coating methods for sample preparation and investigating the influence of the measurement device on the results.
Stage: Mailand
Thursday, May 11, 2023, 2:00 pm
Visitors to the Rogers booth can learn more about curamik ceramic substrates designed for high-demand applications. The basis of the substrate is a ceramic insulator to which pure copper is applied. The result is ceramic substrates with high thermal conductivity, high heat capacity and heat spreading provided by the thick copper layer. These high-performance substrates are well-suited for power electronics applications.
Visitors will also have the chance to discover the wide range of ROLINX customized busbar solutions and assemblies renowned for their reliability, safety and durability in the most demanding applications, including mass transit and electric propulsion, industrial drives, renewable energy and automotive systems. ROLINX busbar solutions offer low inductance, compact and highly customizable designs and, in combination with capacitors, extremely low inductance and high-power density capabilities.
Suggested Items
New Yorker, Major League Electronics Sign New Franchised Distribution Agreement
05/06/2024 | New Yorker Electronics Co.New Yorker Electronics, global distributor of electronic components, recently announced a new franchised distribution agreement with Major League Electronics, renowned manufacturer of interconnect products.
AT&S Brings High-Tech to the Museumsquartier
05/06/2024 | AT&SAT&S, as a “MQ goes Green” partner, has prepared special highlights for the occasion: Visitors aged eight and above can embark on an interactive journey through the fascinating world of microelectronics.
May Issue of SMT007 Magazine: Coming to Terms With AI
05/06/2024 | I-Connect007 Editorial TeamIn the May 2024 issue of SMT007 Magazine, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/03/2024 | Nolan Johnson, I-Connect007This week’s most important news is strategic—and telling. When one puts together the IPC industry reports, we simply have to include the recent conversation with Shawn DuBravac and Tom Kastner. On the design side, check out the latest “On The Line With…” podcast featuring Brad Griffin from Cadence Design Systems, discussing SI and PI in the realm of intelligent system design.
IMI Welcomes New CEO
05/03/2024 | IMIIntegrated Micro-Electronics, Inc. (IMI),The IMI Board of Directors announced, in a disclosure dated April 25, 2024, the appointment of Louis Sylvester Hughes, Chief Executive Officer (CEO).